SOURCE: Lam Research Corporation

Lam Research Corporation

July 13, 2015 16:07 ET

Lam Research Ships 200th Kiyo® Conductor Etch Module With Proprietary Hydra® Technology

Milestone Showcases Expanding Leadership in Multiple Patterning With Recent Wins for Advanced Nodes at Leading Logic and Memory Customers

FREMONT, CA--(Marketwired - July 13, 2015) - Lam Research Corp. (NASDAQ: LRCX), a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today announced it has shipped its 200th Kiyo® conductor etch module with proprietary Hydra® technology. By enabling multiple patterning inflections at advanced nodes, the product is rapidly gaining momentum with customers across industry segments. In memory, the installed base is growing as a result of implementation for advanced DRAM, planar NAND, and 3D NAND with shipments doubling in the past quarter. In logic, the product is positioned at all major foundries and manufacturers focused on multi-patterning-intensive FinFET technology. In addition, Lam's Kiyo with Hydra technology was recently successful in expanding its applications base at the 10 nm node by greater than five-fold over the previous node at a leading U.S. logic manufacturer.

"Achieving this important product milestone demonstrates not only our leadership in multi-patterning, but also that focusing on customers' toughest challenges increases our opportunity node over node," said Richard Gottscho, Lam's executive vice president of Global Products. "As the complexity of scaling continues to increase, driving both technical and economic challenges, our focus on collaboration is more critical than ever in helping our customers sustain long-term success."

Multi-patterning schemes enable continued scaling for leading-edge logic and memory devices and require strict critical dimension (CD) and uniformity control across the wafer and from wafer to wafer. As the number of process steps for these applications continues to grow, minimizing variability is increasingly important as each additional step contributes to overall variation. At the same time, high productivity solutions are needed to offset increasing manufacturing costs due to added steps. As part of Lam's market-leading Kiyo conductor etch family, Kiyo with Hydra technology addresses these challenges while delivering cost-effective productivity. A symmetrical chamber design with radial tuning provides best-in-class uniformity to minimize CD variability. The Hydra Uniformity System employs advanced software algorithms in combination with proprietary hardware technology to enable localized fine tuning that minimizes variation across the wafer by correcting for incoming pattern non-uniformities. In addition, multiple process steps can be completed in one pass to reduce manufacturing costs.

About Lam Research
Lam Research Corp. (NASDAQ: LRCX) is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand, resulting in smaller, faster, and more power-efficient chips. Through collaboration, continuous innovation, and delivering on commitments, Lam is transforming atomic-scale engineering and enabling its customers to shape the future of technology. Based in Fremont, Calif., Lam Research is a NASDAQ-100 Index® and S&P 500® company whose common stock trades on the NASDAQ® Global Select Market™ under the symbol LRCX. For more information, please visit http://www.lamresearch.com. (LRCX-P)

Caution Regarding Forward-Looking Statements
Statements made in this press release that are not of historical fact are forward-looking statements and are subject to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate to, but are not limited to, statements concerning future or anticipated customer needs, technology requirements, economic challenges, tool capabilities, the financial prospects for Lam's equipment and services, and other market opportunities. Such forward-looking statements are based on current beliefs and expectations and are subject to risks, uncertainties and changes in condition, significance, value and effect, including important factors such as equipment and process developments, customer and consumer demands, technology developments and those discussed in Lam's annual report on Form 10-K under the heading "Risk Factors" as well as in other documents filed by Lam with the Securities and Exchange Commission. Such risks, uncertainties and changes in condition, significance, value and effect could cause actual results to differ materially from those expressed herein and in ways not readily foreseeable. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the dates made and of information reasonably known to Lam as of the dates the statements were made. We undertake no obligation to release the results of any revisions to these forward-looking statements which may be made to reflect events or circumstances which occur after the date hereof or to reflect the occurrence or effect of anticipated or unanticipated events.

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