SOURCE: Teridian Semiconductor

Teridian Semiconductor

December 15, 2009 10:00 ET

Lantiq Selects Teridian Semiconductor for Customer Premise Equipment Reference Designs

Teridian 73M1x66B Offers Reduced Bill of Materials Cost for Global VoIP Deployments

IRVINE, CA--(Marketwire - December 15, 2009) - Teridian Semiconductor today announced that Lantiq, the market leader for DSL Integrated Access Device (IAD) integrated circuits (ICs), has chosen the 73M1x66B IC for its Customer Premise Equipment (CPE) reference designs. Teridian's IC takes an innovative approach in addressing the Foreign-Exchange-Office (FXO) function, facilitating superior voice quality and significant bill of materials (BOM) cost reductions in Voice-over-IP (VoIP) applications. Teridian's 35 years of modem DAA experience and successful track record of worldwide deployments, as well as a compelling cost roadmap, were key factors in Lantiq's decision to utilize its 73M1x66B IC in their reference design.

The 73M1x66B MicroDAA™ family uses Teridian's unique data access arrangement (DAA) function, designed exclusively for the FXO feature of VoIP systems, in addition to providing the circuitry to connect PCM-formatted voice channels to a PSTN via a two wire, twisted pair interface. Host-side power support renders the device independent of PSTN loop variations, generating robust performance in any deployment environment. The 73M1x66B offers programmable PSTN terminations enabling equipment to be deployed anywhere in the world without any BOM changes. With best-in-class return loss, EMI and Common Mode noise performance, system designers are assured superior voice quality.

"We are pleased to be working with Lantiq, the world's leading supplier of xDSL access and home networking technologies for next generation networks," said Jay Cormier, vice president and general manager, Energy Measurement and Communication, Teridian Semiconductor. "The 73M1x66B solution is another prime example of Teridian enabling superior performance and simplifying system integration with cost reductions through our innovative mixed-signal designs. For Lantiq, it was equally important to have a partner that contributes to BOM reductions and offers a solution with optimum system partitioning for its portfolio of CPE devices including DANUBE, VINAX and the xRX100 and xRX200 product families."

The 73M1866B and 73M1966B solutions are currently in volume production; pricing is available upon request. Development kits for both devices are also available and include a ready-to-use board, firmware and software libraries and a reference design.

For additional information, contact any Teridian sales representative, authorized worldwide distributor or visit Teridian's website at

About Teridian Semiconductor

Teridian Semiconductor designs, manufactures and provides engineering support for its system-on-chip integrated circuits used in the energy measurement, control and communication markets, networking and secure access systems.

Teridian integrated circuits are widely used in global applications such as set top box, Voice-over-IP, fax and MFP applications, electronic identity, and payment systems. Teridian's products are used in smart utility meters, as well as enterprise based solutions such as servers, power distribution units and outlet monitoring devices to measure power dissipation with high accuracy, and enable communication processing of recorded energy data.

Additional company and product information can be found at

Contact Information

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    Lages & Associates Inc.