SOURCE: Lattice Semiconductor Corporation

Lattice Semiconductor Corporation

September 21, 2010 03:01 ET

Lattice Programmable Logic Devices "Go Green" for Consumer Electronics

Environment-Friendly Material Options for the ispMACH 4000ZE CPLD Family Now Available

HILLSBORO, OR--(Marketwire - September 21, 2010) -  Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the availability of halogen- and lead-free packages for its ispMACH® 4000ZE CPLD family, a popular programmable logic solution for high-volume consumer electronics. Bromine and chlorine, halogens associated with ozone depletion, have been replaced with metal oxides or red phosphorous. Lead and halogens have been eliminated from several components of the ispMACH 4000ZE IC package material to comply fully with industry standards such as Japan's JEIDA and Europe's WEEE. For lead-frame based packages, the plating process has been modified to remove lead, and halogens have been removed from die-attach and mold compounds that encapsulate the IC.

"Halogen elements are used in some IC substrate material, and in sufficient quantities they can be harmful to biological organisms. Manufacturers of consumer electronics devices are concerned about the environmental impact of their products," said Gordon Hands, Director of Marketing for Low Density and Mixed Signal Solutions. "Lattice is excited to provide our customers with programmable logic devices that allow them to meet higher standards for electronic waste while still meeting their power and cost targets. The ispMACH 4000ZE is a proven green PLD for use in devices as diverse as portable GPS and mobile handsets, to digital set top boxes (STBs) and multi-function printers."

Lead- and Halogen-Free Package Options

Lattice has qualified a wide variety of package types in lead-free configurations. These qualified packages include the Plastic Leaded Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Fine Pitch BGA (fpBGA), Fine Pitch Thin BGA (ftBGA), Chip Scale BGA (csBGA), Ultra Chip Scale BGA (ucBGA), Chip Array BGA (caBGA), Flip Chip BGA (fcBGA), and Quad Flat-pack Saw-singulated (QFNS). Lattice's lead-free packages offer the same high quality and reliability benefits as devices that contain lead. For more information on Lead-Free, RoHS Compliant Packaging Support from Lattice, visit the Lattice web site at

All TQFP package variations and the 64-Ball csBGA package of the ispMACH 4000ZE family are now halogen free and use pure tin (Sn 100%) for lead plating.

Package Lead-Free Halogen-Free
48-Pin TQFP 4032ZE
64-Ball csBGA 4032ZE
64-Ball ucBGA 4064ZE  
100-Pin TQFP 4064ZE
132-Ball ucBGA 4128ZE  
144-Pin TQFP
Package Composition
TQFP Lead plating:
Sn 100% (pure tin)
csBGA, ucBGA Solder ball composition:
Sn 96.5% / Ag 3% / Cu 0.5%

Environmental Information from Lattice
Lattice publishes a variety of environmental information resources on its website:

Quality, Reliability and Environmental Information

Device Material Content

Lead Free, RoHS Compliant Packaging Support

Pricing and Availability
All ispMACH 4000 CPLDs are fully production qualified and have been shipping for ten years. ispMACH 4000 CPLDs feature a broad range of densities, packages and speed grade options and are available for ordering via the Lattice online store at and through authorized Lattice distributors at

ispMACH 4000 CPLDs are available for $0.50 for 32-macrocell devices in high volume. For more information about the Lattice ispMACH 4000ZE CPLD family, visit

For more information on Lattice CPLD development kits, visit

The design software for the ispMACH 4000, ispLEVER® Classic software, can be downloaded from the Lattice website at

About Lattice Semiconductor
Lattice is the source for innovative FPGA, PLD, programmable Power Management and Clock Management solutions. For more information, visit

Lattice Semiconductor Corporation, Lattice (& design), L (& design), ispMACH, ispLEVER and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.

Contact Information

    Brian Kiernan, Corporate Communications Manager
    Lattice Semiconductor Corporation
    503-268-8739 voice
    503-268-8193 fax