SOURCE: Lattice Semiconductor Corporation

Lattice Semiconductor Corporation

February 12, 2014 07:00 ET

Lattice Semiconductor Demonstrating New USB3 and HMI Solutions, Presenting Papers on MIPI Interfacing at Embedded World

Papers Address Design Challenges for Display Applications: Latest Products to Be Shown With Distribution Partners Arrow and Future Electronics

HILLSBORO, OR--(Marketwired - Feb 12, 2014) - Lattice Semiconductor Corporation (NASDAQ: LSCC) will demonstrate new USB3 and Human Machine Interface (HMI) solutions, and address how embedded designers can use low-power, low-cost FPGAs (Field Programmable Gate Arrays) to overcome the challenges of implementing MIPI interfaces at the Embedded World Exhibition and Conference taking place in Nuremberg, Germany, Feb. 25-27.

HMI-on-a-Chip (HOC) is a complete Lattice FPGA-based single chip HMI reference design demonstrating touch screen based HMI solutions. The solution is scalable and can be implemented using Lattice's family of MachXO2™ or MachXO3™ FPGAs as well as LatticeECP3™ devices.

"The key benefits of the solution are scalability, high-end graphics, fast response times, and ease of HMI design," explains Lattice Strategic Marketing and Business Development Manager Kambiz Khalilian. "Unlike microcontroller-based solutions, the Lattice HMI solution is editor-based, so no programming or operating system expertise is required."

The Lattice USB3 Video Bridge reference design addresses emerging applications in consumer, video broadcast, machine vision, and surveillance applications built around the new USB3 interface.

"USB3 is amongst the preferred formats for reasons of flexibility, cost, size and availability of standard parts," said Khalilian. "However, since image sensor, SDI, or HDMI video & audio formats are different than USB3 data format, a bridge design is required, and low cost, low power FPGAs are ideal for this application."

Lattice will demonstrate the new USB3 and HMI solutions at the Arrow Electronics booth (Hall 5/Booth 370) and Future Electronics booth (Hall 4A/ Booth 110), two of Lattice's authorized distributors.

Ted Marena, Lattice's director of product marketing for MachXO Families, will present two papers at the Nuremberg event that address the emerging use of the Mobile Industry Processor Interface, or MIPI standards, within the context of embedded designs and specifically for display applications. Marena will discuss how small-form factor FPGAs with their low power and low cost can help designers to overcome the system design challenges that must be addressed when integrating low-cost, high-reliability components designed for smart phones and tablets.

On Feb. 25 at 2:00 pm Marena will present a paper at the Embedded World Conference titled 'MIPI Interfaces in Embedded Designs with Ultra-Low-Density, Low-Power, Low-Cost FPGAs'.

On Feb. 26 at 2:00 pm Marena will deliver his paper 'Using low cost MIPI Displays in Embedded Applications' at the Electronic Displays conference, an event within Embedded World -- further details can be found at: http://www.embedded-world.de/en/conference/.

About Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) is the world's leading provider of ultra-low-power programmable IC solutions for makers of smartphones, mobile handheld devices, small-cell networking equipment, industrial control, automotive infotainment, and much more. With more than 1 billion units sold over the past 10 years, Lattice ships more FPGAs, CPLDs and Power Management solutions than any other programmable solutions vendor. For more information, visit www.latticesemi.com. You can also follow us via Twitter, Facebook, or RSS.

Lattice Semiconductor Corporation, Lattice (& design), L (& design), LatticeECP3, MachXO2, MachXO3 and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

MIPI is a licensed trademark of MIPI, Inc. in the U.S. and other jurisdictions.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.