SOURCE: Lattice Semiconductor Corporation

Lattice Semiconductor Corporation

November 29, 2010 03:01 ET

LatticeECP3 Device Is First Low Cost FPGA to Support Broadcom HiGig™ Protocol

Enables Low Power Bridging and Switching Applications With Broadcom Devices

HILLSBORO, OR--(Marketwire - November 29, 2010) - Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of the HiGig™ MAC IP core for its award winning, low cost LatticeECP3™ FPGA family. Multiple individual devices interconnected via the HiGig protocol operate as one logical network, seamlessly providing features like quality of service (QoS), mirroring and link aggregation. The HiGig MAC ensures that the Media Access rules specified in the 802.3ae IEEE standard and HiGig Protocol definitions are met while transmitting a frame of data over Ethernet. On the receive side, it extracts the different components of a frame and transfers them to higher applications through a FIFO interface. With this new Lattice IP core, designers will be able to implement low cost network solutions using Broadcom devices. 

Compliant with Broadcom HiGig and HiGig2™ protocol definitions, the HiGig MAC IP core has a 64-bit wide internal data path operating at a maximum frequency of 156 MHz on the LatticeECP3 FPGA. The core provides XGMII and XAUI interfaces to the PHY layer and supports variable-sized packet transmission with fixed-sized messaging capability (HiGig2 only). With multicast address filtering and 16-bit statistics counters, the core requires approximately 4100 FPGA look-up tables (LUTs) for HiGig implementations and approximately 4700 FPGA LUTs for HiGig2 implementations.

"Broadcom continues to expand the vibrant HiGig ecosystem and we are pleased to welcome Lattice to the growing number of partners that support HiGig," said John Mui, Senior Product Line Manager at Broadcom Corporation. "The low power LatticeECP3 FPGA family, coupled with the HiGig IPcore from Lattice, provides a cost effective platform for interfacing with Broadcom devices, enabling high speed Ethernet solutions for the Service Provider, Data Center and Enterprise markets."

 "The small footprint HiGig MAC IP core will help designers develop bridging and switching solutions with Broadcom devices," said Lalit Merani, Lattice Senior Product Marketing Manager. "This is another example of how Lattice has responded to the needs of its customers by focusing on low-cost and low-power design with the LatticeECP3 FPGA family."

The HiGig MAC IP core developed by Lattice is supported by Lattice's IPexpress™ FPGA design tool module. Included as a standard feature in the Lattice Diamond™ design environment, the IPexpress module significantly reduces design time by allowing IP parameterization and timing analysis on the designer's desktop. This allows users to customize Lattice's extensive library of IP functions for their unique applications, integrate them with their proprietary FPGA logic designs and evaluate the overall device operation via simulation and timing analysis prior to making any IP purchase commitments.

Pricing and Availability
The HiGig MAC IP core is available now and can be ordered through Lattice sales with a low list price of $5,000. For more information about the IP core please visit

About the LatticeECP3 FPGA Family
The LatticeECP3 FPGA family is comprised of five devices that offer standards-compliant multi-protocol 3.2G SERDES, DDR1/2/3 memory interfaces and high performance, cascadable DSP slices that are ideal for high performance RF, baseband and image signal processing. Toggling at 1Gbps, the LatticeECP3 FPGAs also feature fast LVDS I/O as well as embedded memory of up to 6.8 Mbits. Logic density varies from 17K LUTs to 149K LUTs with up to 586 user I/O. The LatticeECP3 FPGA family is ideally suited for deployment in high volume cost- and power-sensitive wireline and wireless infrastructure applications.

About Lattice Semiconductor
Lattice is the source for innovative FPGA, PLD, programmable Power Management and Clock Management solutions. For more information, visit

Lattice Semiconductor Corporation, Lattice (& design), L (& design), LatticeECP3, IPexpress, Lattice Diamond and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

HiGig and HiGig2 are trademarks of Broadcom Corporation in the United States and/or other countries.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.

Contact Information

    Brian Kiernan
    Corporate Communications Manager
    Lattice Semiconductor Corporation
    503-268-8739 voice
    503-268-8193 fax