SOURCE: Aprio Technologies

January 29, 2007 08:00 ET

Leading Taiwanese Company Selects Aprio's DFM Solution

Winbond to Use Halo-Fix to Accelerate Production OPC Flow

SANTA CLARA, CA -- (MARKET WIRE) -- January 29, 2007 -- Aprio Technologies, Inc., one of the electronic design automation (EDA) industry's technology leaders in design-for-manufacturability (DFM) solutions, today announced that Taiwanese IC product solutions supplier Winbond Electronics Corporation has selected Halo™-Fix, Aprio's rapid localized optical proximity correction (OPC) repair and optimization solution.

Released last year, Halo-Fix accelerates mask data prep throughput and reduces release to manufacturing cycle times by providing rapid, localized repairs to OPC data. Halo-Fix works with all major commercial lithography rule check (LRC) and OPC tool sets.

"Winbond remains competitive by focusing on constantly honing our technological expertise. With Halo-Fix, we can reduce our mask data prep cycle time by deploying a robust and incremental DFM repair methodology," commented C.Y. Huang, Winbond Lithography Manager.

With Halo-Fix, users of commercial LRC or OPC tools can access a unique OPC repair capability. Defects and/or error flags from any mainstream LRC tool can be used to identify the areas requiring repair. Halo-Fix then applies localized OPC repair techniques that do not disturb the portions of the design that have already passed LRC. Halo-Fix's incremental capabilities can also be used in conjunction with the customer's OPC tools to reduce the design's sensitivity to process window variation without making changes to the golden OPC recipe. Using Halo-Fix, OPC closure can be achieved in a fraction of the time of conventional tools.

"The adoption of Halo-Fix by Winbond continues to validate the effectiveness of this unique solution," said Clive Wu, founder and chief executive officer of Aprio Technologies. "We are delighted to be able to assist Winbond in reducing their mask data preparation cycle time."

About Aprio

Founded in 2003 and headquartered in Santa Clara, California, Aprio Technologies, Inc. is a leader in design-for-manufacturability (DFM) solutions that ensure successful design and fabrication of nanometer technology semiconductors. At the core of Aprio's offerings is its unique capability to provide correct and accurate information; to designers about manufacturing issues, and to manufacturing engineers about design intent. Aprio's products leverage this capability to help our customers create more reliable and better yielding semiconductors without the need for dramatic changes to their existing design or tapeout flows. For more information, visit Aprio's Web site at or call +1(408) 855-8088.

Contact Information

  • For more information, contact:
    Eva Kam
    Alanza Technologies, Inc.
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