SOURCE: The Linley Group

The Linley Group

October 19, 2010 10:11 ET

Linley Tech High-Speed Interconnects Seminar Highlights Trends in Physical Layer Technologies

Technologists Discuss Standards Supporting Date Rates From 3 Gbps Up to 100 Gbps and Beyond

MOUNTAIN VIEW, CA--(Marketwire - October 19, 2010) - The Linley Group, the industry's leading source for independent technology analysis of semiconductors for networking, communications, mobile, and wireless, will host the Linley Tech High-Speed Interconnects Seminar on November 3, at the Doubletree Hotel in San Jose, Calif. The event will feature presentations from leading companies involved in implementing interconnect technologies into their designs at the board level, over the backplane, chip-to-chip, and between systems.

Presenters and topics include:

  • AppliedMicro Director of Systems Engineering Dariush Dabiri - "Electromagnetic Interference Cancellation for 10GBASE-T Receiver: New Challenges for Coexistence Between Wireless and Wireline Communication Systems"
  • Finisar Strategic Technology Initiatives Katharine Schmidtke - "Technology Advancements in High-Bandwidth Optical Interconnects"
  • Freescale System Architect, Network Systems Division, Jim Innis - "Meeting the Challenges of High Speed Connectivity in Embedded Applications"
  • IDT Senior Product Manager Trevor Hiatt - "Technical Comparison of Ethernet and RapidIO in Intra- and Inter-chassis Usage"
  • Marvell CTO, Enterprise Business Unit, Nafea Bshara - "40GbE Ethernet for Low-latency HPC Applications"
  • MoSys Vice President of Technology Innovation and System Applications Michael Miller - "Bandwidth Density Challenge Beyond 100Gbps"
  • PLX Technology Vice President of Engineering Vijay Meduri - "PCI Express as a Clustering and Remote-I/O Interconnect"
  • Xilinx Senior Marketing Manager Panch Chandrasekaran and Senior Technical Marketing Manager Anthony Torza - "Building Optically Compliant High Performance Serial Links"

Registration
The Linley Tech High-Speed Interconnects Seminar takes place on Wednesday, Nov. 3, with a continental breakfast and registration beginning at 8:15. The Linley Tech High-Speed Interconnects Seminar is intended for OEMs, ODMs, board developers, software developers, press and the financial community. The Linley Group offers free attendance to qualified registrants who sign up by October 29. For more information on the seminar program and to register, please visit http://www.linleygroup.com/Seminars/hsi2010.html.

About The Linley Group
The Linley Group is the industry's leading source for independent technology analysis of semiconductors for networking, communications, mobile, and wireless applications. The company provides strategic consulting services, in-depth analytical reports, and Linley Tech events focused on advanced technology topics. The Linley Group is also the publisher of Microprocessor Report, the leading technical publication for unbiased analysis of high-performance processor technology. For insights on recent industry news, subscribe to the company's free email newsletters: "Linley Wire," "Linley on Mobile," and "Processor Watch" and follow us on Twitter @linleygroup.

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