SOURCE: Mattson Technology, Inc.

Mattson Technology, Inc.

August 23, 2011 06:30 ET

Mattson Technology Extends RTP Leadership With Shipment of Millios® Millisecond Anneal System for Advanced Sub-2X nm Device Development

FREMONT, CA--(Marketwire - Aug 23, 2011) - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that a major semiconductor manufacturer has purchased its Millios® millisecond anneal system for the evaluation of future logic devices. The Millios demonstrated unique technological advantages that enable chipmakers to maximize integrated circuit performance on advanced logic devices. The system has already been delivered to the customer and will be used for sub-2X nanometer (nm) applications.

The Millios offers millisecond anneal processing time from 0.5 to 10.0 milliseconds, the widest operating space of any millisecond anneal system on the market. This continuously variable process duration, which is applied across the entire wafer surface, enables advanced sub-20 nm processes while setting the industry's benchmark for productivity. The Millios is the only tool in the market that offers direct wafer temperature measurement during the entire millisecond anneal. Mattson Technology's proprietary temperature measurement system ensures process repeatability, which provides increased production reliability.

"Our strategic R&D investments have resulted in a millisecond anneal system that delivers technologically superior processing results and a compelling value proposition," commented Andreas Toennis, senior vice president and general manager of the Thermal Products Group at Mattson Technology. "This latest purchase by yet another major semiconductor manufacturer extends Mattson Technology's RTP position further into the logic/foundry markets, and we believe Millios' success will continue to drive our expanding share of the advanced RTP market over the next several years. We look forward to working with our customer to address critical transistor scaling challenges with our unique millisecond anneal system to fabricate next-generation device designs for sub-2X logic processes."

About Mattson Technology, Inc.
Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company is a leading supplier of plasma and rapid thermal processing equipment to the global semiconductor industry, and operates in three primary product sectors: dry strip, rapid thermal processing (RTP) and etch. Through manufacturing and design innovation, Mattson Technology produces technologically advanced systems that provide productive and cost-effective solutions for customers fabricating current- and next-generation semiconductor devices. The company serves foundries, and memory and logic integrated device manufacturers in the United States, Europe, China, Japan, Korea, Singapore, Taiwan and other Asian countries. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, CA, 94538. Telephone: +1-800-MATTSON/+1-510-657-5900. Internet:

"Safe Harbor" Statement Under the Private Securities Litigation Reform Act of 1995: This news release contains forward-looking statements. Forward-looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially. Such risks and uncertainties include, but are not limited to: end-user demand for semiconductors; customer demand for semiconductor manufacturing equipment; the timing of significant customer orders for the Company's products; customer acceptance of delivered products and the Company's ability to collect amounts due upon shipment and upon acceptance; the Company's ability to timely manufacture, deliver and support ordered products; the Company's ability to bring new products to market and to gain market share with such products; customer rate of adoption of new technologies; risks inherent in the development of complex technology; the timing and competitiveness of new product releases by the Company's competitors; the Company's ability to align its cost structure with market conditions; and other risks and uncertainties described in the Company's Forms 10 K, 10-Q and other filings with the Securities and Exchange Commission. The Company assumes no obligation to update the information provided in this news release.

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