SOURCE: Mattson Technology, Inc.

Mattson Technology, Inc.

July 12, 2011 06:30 ET

Mattson Technology Introduces paradigmE Si Silicon Etch System at SEMICON West 2011

New System Delivers High Productivity, Low Cost-of-Ownership for Semi-Critical Silicon Etch Applications

FREMONT, CA--(Marketwire - Jul 12, 2011) - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today introduced the paradigmE® Si for semi-critical silicon etch applications. The latest silicon etch system reinforces the new etch standard created by Mattson Technology's production-proven paradigmE, which enables customers to meet stringent processing requirements for device manufacturing at leading-edge technology nodes. Multiple paradigmE Si systems are already in customer production.

Built on the paradigmE product architecture, paradigmE Si incorporates enhancements to enable customers to run the chemistries required for poly-silicon applications. The system features Mattson Technology's proprietary Faraday shield designed to improve etch process control and enhance mean-time-between-clean (MTBC) performance by up to three times over competitive systems. The paradigmE Si also enables true independent control of ion density and energy, providing improved profile control and minimized sputtering to reduce maintenance costs for the lowest cost-of-ownership.

"Customers currently use critical poly etchers to run semi-critical applications, and this tool-application mismatch results in a higher cost of ownership," said Rene George, vice president and general manager of Mattson Technology's Plasma Products Group. "The paradigmE Si is specifically targeted at semi-critical poly etch applications by providing excellent process performance with over 30% better cost-of ownership advantages over any competitive etch system currently on the market. The introduction of this latest tool to our etch portfolio enables us to serve approximately 30% of the growing silicon etch market, broadens our etch application set and expands our total served available market by over $500 million."

Customers can learn more about the paradigmE Si poly etch system during SEMICON West 2011 in Mattson Technology's booth 231 in Moscone Center's South Hall.

According to a recent Worldwide Dry Etch Equipment Market forecast report by independent research firm Gartner Dataquest, the silicon etch market size for 2010 was $1.937 billion and is expected to grow to $1.957 billion in 2011.

About Mattson Technology, Inc.
Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company is a leading supplier of plasma and rapid thermal processing equipment to the global semiconductor industry, and operates in three primary product sectors: dry strip, rapid thermal processing (RTP) and etch. Through manufacturing and design innovation, Mattson Technology produces technologically advanced systems that provide productive and cost-effective solutions for customers fabricating current- and next-generation semiconductor devices. The company serves foundries, and memory and logic integrated device manufacturers in the United States, Europe, China, Japan, Korea, Singapore, Taiwan and other Asian countries. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, CA, 94538. Telephone: +1-800-MATTSON/+1-510-657-5900. Internet:

"Safe Harbor" Statement Under the Private Securities Litigation Reform Act of 1995: This news release contains forward-looking statements. Forward-looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially. Such risks and uncertainties include, but are not limited to: end-user demand for semiconductors; customer demand for semiconductor manufacturing equipment; the timing of significant customer orders for the Company's products; customer acceptance of delivered products and the Company's ability to collect amounts due upon shipment and upon acceptance; the Company's ability to timely manufacture, deliver and support ordered products; the Company's ability to bring new products to market and to gain market share with such products; customer rate of adoption of new technologies; risks inherent in the development of complex technology; the timing and competitiveness of new product releases by the Company's competitors; the Company's ability to align its cost structure with market conditions; and other risks and uncertainties described in the Company's Forms 10 K, 10-Q and other filings with the Securities and Exchange Commission. The Company assumes no obligation to update the information provided in this news release.

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