SOURCE: Mattson Technology, Inc.

Mattson Technology, Inc.

October 19, 2009 08:30 ET

Mattson Technology's Alpine™ Etch System Expands Into Packaging Market

Ships Alpine™ Etch System to a Leading Logic Customer for Advanced Packaging Applications

FREMONT, CA--(Marketwire - October 19, 2009) - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that a leading global semiconductor manufacturer has selected its Alpine™ etch system for advanced wafer-level packaging applications. The system has shipped to the manufacturer's latest 300mm packaging facility in Asia. The shipment represents the third customer placement for Mattson's etch products. Introduced in 2008, the Alpine etch system has demonstrated greater than 30% Cost-of-Ownership reduction against a leading etch competitor for the back-end-of-line integration of low-k dielectric and copper. The same technology is now extending into the packaging arena where the Cost-of-Ownership and ion control provide key differentiation against other tools available in the market.

Senior Vice President and General Manager of Mattson Technology's Plasma Products Group, Randy Matsuda, noted, "We are extremely pleased with the selection and shipment of the Alpine etch system to this long standing customer of Mattson. Their decision to place an Alpine etch system was based on proven performance from our earlier work with them. This selection of our Alpine etch system is further validation of their continued confidence in Mattson's technology and its capabilities in meeting their requirements for the wafer-level packaging applications."

Matsuda continued, "In order to keep pace with the Moore's law, our customers continue to require enabling solutions while maintaining the lowest possible cost. In response, we at Mattson continue to strive to provide answers that meet the changing requirements of the industry. The Alpine etch system for packaging is the latest example of our continued commitment to deliver unique and innovative solutions that the customers require. We look forward to working closely with our customers as their trusted solution provider."

About Alpine™

The Alpine™ enables chipmakers to handle copper/low-k dielectric integration, resist etch back, barrier layer removal and other BEOL challenges with a single tool. The Alpine also enables back-end wafer level packaging customers to address increasingly challenging integration processes related to wafer bumping and 3D packaging processes. The Alpine features Mattson's proprietary inductively coupled plasma (ICP) source and a bias capability providing improved profile control, low-k material preservation and a wider process window. The system builds on Mattson's latest production proven platform and is designed for reliable, high-productivity, low cost-of-ownership manufacturing for sub-65 nanometer nodes and advanced packaging applications.

About Mattson Technology, Inc.

Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. We are a leading supplier of plasma and rapid thermal processing equipment to the global semiconductor industry. Through manufacturing and design innovation, we have produced technologically advanced systems that provide productive and cost effective solutions for customers fabricating current- and next-generation semiconductor devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, CA, 94538. Telephone: (800) MATTSON/(510) 657-5900. Internet:

"Safe Harbor" Statement Under the Private Securities Litigation Reform Act of 1995: This news release contains forward-looking statements. Forward-looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially. Such risks and uncertainties include, but are not limited to: end-user demand for semiconductors; customer demand for semiconductor manufacturing equipment; the timing of significant customer orders for the Company's products; customer acceptance of delivered products and the Company's ability to collect amounts due upon shipment and upon acceptance; the Company's ability to timely manufacture, deliver and support ordered products; the Company's ability to bring new products to market and to gain market share with such products; customer rate of adoption of new technologies; risks inherent in the development of complex technology; the timing and competitiveness of new product releases by the Company's competitors; the Company's ability to align its cost structure with market conditions; and other risks and uncertainties described in the Company's Forms 10-K, 10-Q and other filings with the Securities and Exchange Commission. The Company assumes no obligation to update the information provided in this news release.

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