SOURCE: ProPlus Design Solutions

October 22, 2012 09:19 ET

MEDIA ALERT: ProPlus Design Solutions to Sponsor IC China 2012 Opening Reception Dinner, Executive Chairman Dr. Zhihong Liu Featured Speaker

ProPlus to Demonstrate Entire Portfolio of Design for Yield Software During Exhibition

SAN JOSE, CA--(Marketwire - Oct 22, 2012) -

WHO: ProPlus Design Solutions (www.proplussolutions.com), provider of unique Design for Yield (DFY) solutions that integrate device modeling, parallel SPICE simulation and statistical analysis

WHAT: Will sponsor the opening dinner reception for the 10th China International Semiconductor Exhibition and Forum (IC China 2012), a forum for industry exchange and international cooperation on the development of China's semiconductor industry, ProPlus Design Solutions' Executive Chairman Dr. Zhihong Liu will be the keynote speaker.

WHEN: Tuesday, October 23

WHERE: Shanghai World Expo, Shanghai, China

Additionally, Dr. Liu will give a talk titled, "Meeting the Design and Manufacturing Challenges for 65nm and Beyond: Trade-Off Between Yield and Performance," 10:05 a.m., October 24. During the exhibition October 23-25, ProPlus Design Solutions will demonstrate its device modeling, SPICE simulation and DFY software, including the newly introduced NanoYield™, fast and accurate yield prediction and optimization software for memory, logic, analog and digital circuit design.

For more information about ProPlus Design Solutions, visit: www.proplussolutions.com.

Details on IC China 2012, the largest annual event organized by the China Semiconductor Industry Association, can be found at: www.ic-china.org/english/

About ProPlus Design Solutions
ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions that enhance the link between design and manufacturing. It provides unique Design for Yield (DFY) solutions that integrate device modeling software, a parallel SPICE engine and statistical analysis algorithms. Products include: BSIMProPlus™, a leading device modeling technology platform for nanometer device fabrication, NanoSpice™, a full-chip parallel SPICE simulator with full-chip capacity and SPICE accuracy for transistor-level statistical simulation and analysis, and NanoYield™, a DFY platform to meet performance and yield optimization challenges of advanced memory, analog and digital circuit designs. ProPlus Design Solutions has R&D centers in the San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at www.proplussolution.com.

BSIMProPlus, NanoSpice and NanoYield are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

Contact Information

  • For more information, contact:
    Nanette Collins
    Public Relations for ProPlus Design Solutions
    (617) 437-1822
    Email Contact