Memory Designers Choose NanoSpice Giga Simulator From ProPlus Design Solutions

SAN JOSE, CA--(Marketwired - May 26, 2015) - NanoSpice Giga™, the high-capacity, high-performance parallel GigaSpice simulator from ProPlus Design Solutions, Inc., is realizing widespread adoption by leading memory designers worldwide.

Advanced memory circuit simulation requires superior accuracy, a growing limitation of FastSPICE simulators, to manage shrinking technology, supply voltage reductions and the impact of increasing process variations.

NanoSpice Giga, introduced in 2014, is the first GigaSpice utilizing a pure SPICE simulation engine to handle giga-scale circuit simulations for memory and custom digital designs. NanoSpice Giga offers true SPICE accuracy and stable DC convergence that eliminates the accuracy concerns of FastSPICE, and delivers the simulation results designers need for a high degree of confidence. NanoSpice Giga features big data architecture for efficient memory management and matrix solver technology to handle more than one-billion element circuits for real giga-scale full chip verification and signoff.

Leading memory designers have chosen NanoSpice Giga to replace FastSPICE for highly accurate power and leakage verification and signoff of memory integrated circuits (ICs) such as SRAM, DRAM and flash memory, and characterization of large embedded memory blocks. Foundry-validated accuracy and compatibility for advanced nodes including 16/14/10-nm FinFET and 28nm FD-SOI enable designers to use NanoSpice Giga for the most advanced memory designs.

Effective model-handling and high-performance scalable parallelization technology enable NanoSpice Giga to run faster than FastSPICE simulators. With NanoSpice Giga, users can get reliable simulation results without the need to experiment with complicated partitioning and any FastSPICE options. It requires no tuning and removes guesswork from FastSPICE. NanoSpice Giga is fully compatible with SPICE and enables drop-in replacement of FastSPICE for verification and signoff in existing design flows.

"Memory designers are facing increasing challenges, especially at advanced nodes like FinFET," remarks Dr. Zhihong Liu, chairman and chief executive officer of ProPlus Design Solutions. "NanoSpice Giga offers them the accuracy confidence they need for reliable simulation results with full SPICE usability and billion elements capacity. That's why it has become memory designers' 'Must Have' tool."

ProPlus at Design Automation Conference
ProPlus will demonstrate NanoSpice Giga and its FinFET-ready design for yield (DFY) products for nano-scale SPICE modeling and giga-scale SPICE simulation at the 52nd Design Automation Conference (DAC) in Booth #1908 June 8-10 at the Moscone Center in San Francisco. Information about DAC is available at: www.dac.com

About ProPlus Design Solutions
ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the leading provider of nano-scale SPICE modeling, giga-scale SPICE simulation and design for yield (DFY) applications, it provides the industry's golden SPICE modeling platform, the first and only GigaSpice simulator, and the only integrated DFY design platform. Founded in 2006, ProPlus Design Solutions has R&D centers in San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at www.proplussolutions.com

BSIMProPlus, Model Explorer, NanoExplorer, NanoSpice, NanoYield and NoisePro are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective products and services.