SOURCE: EoPlex

August 17, 2005 08:00 ET

Mr. Philip E. Rogren Joins EoPlex as VP - Sales & Marketing

Former CSP Marketing Executive to Lead Marketing and Sales Effort for EoPlex

REDWOOD CITY, CA -- (MARKET WIRE) -- August 17, 2005 -- EoPlex Technologies, the company that produces complex 3-D miniature structures by a new "print-forming" technology, announced today that Mr. Philip Rogren has joined the company as Vice President of Sales & Marketing.

Mr. Rogren has over 25 years experience in Sales & Marketing and Engineering in semiconductor packaging and interconnect at companies including Shellcase, Inc., Alcoa Electronic Packaging and Hestia Technologies. Prior to joining EoPlex he was Vice President of Marketing & Sales at Shellcase, Inc., where he was instrumental in establishing Shellcase technology as the standard for CSP packaging for CMOS image sensors. He is the author of two patents for integrated circuit packaging products and is active in industry trade and standards organizations. Mr. Rogren holds a Bachelor of Science degree in Ceramic Engineering from the University of Washington.

Arthur L. Chait, CEO of EoPlex, said, "Phil has been a strong contributor to the semiconductor assembly industry. I am confident that his extensive marketing experience at high technology companies, combined with his intimate knowledge of component and systems-level requirements, will help EoPlex to more rapidly deliver products that bring unprecedented value to our customers. We are looking forward to his contributions to the company and to adding his experience to our senior management team."

About EoPlex

EoPlex Technologies Inc., is a Redwood City, CA company that is developing and commercializing a family of new technologies to manufacture complex miniature 3-D structures, circuits, sensors, and assemblies. The company is backed by Labrador Ventures, Draper Fisher Jurvetson, and Draper-Richards. EoPlex has developed proprietary and patented methods for production (High Volume Print-Forming™ or HVPF™) of 3-D structures from a wide range of metallic and non-metallic materials. Complex shapes such as three-dimensional grids, interwoven circuits, assemblies containing many parts, and multiple material structures can be produced at the same time. The EoPlex process makes it cost effective to mass-produce products, which would be difficult or impossible to manufacture using conventional techniques. Virtually any shape that can be computer modeled or scanned can be produced using EoPlex processes. The greatest cost advantage, however, is with small structures similar in size to semiconductor packaging. The company is currently working with customers in areas that include: 3-D ceramic circuit boards, pressure sensors, fluidics, fuel cells, medical components, thermal management, high-frequency and RF components and other applications.

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