SOURCE: NetXen

April 29, 2008 07:30 ET

NetXen Conducts First End-to-End Demonstration of High-Density 10 Gigabit Copper Interconnect Technology

Solution Offers Multiple Advantages: 75% Reduction in Cost, 50% Reduction in Power and 2X Increase in Density

LAS VEGAS, NV--(Marketwire - April 29, 2008) - Interop -- NetXen, Inc., a leading provider of breakthrough 10-Gigabit Ethernet (10GbE) technology and products, will demonstrate a new 10GbE high-density copper interconnect for the datacenter during Interop Las Vegas, April 29 - May 1, 2008, in NetXen booth #2731.

Deployment of 10 Gigabit Ethernet in the datacenter has been hampered by cost, power and density issues. Optical interconnects remain relatively expensive, CX4 copper has significant usability and cable management issues, and neither approach addresses the need for more port density for top-of-rack switches. Now, a near-term solution is available that addresses these issues.

The SFP+ (enhanced small form factor pluggable) interface has been specified by a multi-source agreement (MSA) that is just now being introduced in the market. The primary advantage over previous XFP solutions is higher density on the switch side. With SFP+ it is now possible to get 48 10GbE ports in a compact 1U form factor, which meets the density requirements for top-of-rack switch infrastructure.

At the same time, optical interconnects remain expensive compared to the cost of 1 Gigabit UTP solutions. As an alternative interconnect solution, NetXen is demonstrating at Interop the use of twinaxial cable using the SFP+ form factor. This solution combines the density of SFP+ with the additional power and cost savings associated with a passive copper interconnect, enabling volume deployment in the datacenter. Additionally, the same switch and server ports can now be used for both copper and optical interconnects providing greater manageability and flexibility for IT managers.

"Switch vendors such as Arastra and Nuova Systems have already announced high density, SFP+ top-of-rack switches," said Vikram Karvat, senior director of marketing at NetXen. "This development, in combination with NetXen's NICs and twinax copper technology, should drive a significant increase in 10 Gigabit Ethernet adoption in the datacenter."

Twinax copper is expected to reduce the switch-to-server interconnect cost by 75%, and interconnect power by more than 50%. These are the types of efficiencies necessary to finally trigger volume adoption of 10GbE.

More information about NetXen's 10 Gigabit Ethernet Intelligent NIC adapters can be found at www.netxen.com. Live demonstrations of NetXen's technology will be shown in booth #2731 at Interop.

About NetXen, Inc.

NetXen, Inc. is a privately held company that manufactures intelligent 10-Gigabit Ethernet networking chips that advance enterprise datacenter performance and agility. Founded in February 2002 by chip design veteran Govind Kizhepat, the company is headquartered in Santa Clara, Calif., with an office in Pune, India. NetXen's protocol- and OS-agnostic Intelligent NICs are designed for volume 10-Gigabit deployments and are targeted at server, storage, security and networking systems. Additional information about the company and its patented chip architecture is available at www.netxen.com.

NetXen, the NetXen logo, and Intelligent NIC are trademarks or registered trademarks of NetXen, Inc. in the U.S. and other countries. All other trademarks are the property of their respective holders.

Contact Information

  • Editorial Contact:
    NetXen, Inc.
    Cheryl Patstone
    Phone: 650-544-9889
    E-mail: Email Contact