SOURCE: NXP Semiconductors

NXP Semiconductors

July 27, 2011 04:00 ET

New Generation of Position Sensors From NXP Improves Performance of Automotive Applications

Unique Magnetoresistive Position Sensors KMA210 Developed on ABCD9

EINDHOVEN, THE NETHERLANDS--(Marketwire - Jul 27, 2011) - NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the release of a new generation of automotive position sensors, KMA210. The KMA210 incorporates NXP's latest magnetoresistive sensor chip and a unique signal conditioning ASIC developed in NXP's advanced Silicon on Insulator (SOI) ABCD9 process technology. It is the first of a new magnetic sensor family in a full system-in-package solution that requires no external components. KMA210 is specially designed to improve the overall performance and increase robustness in automotive applications.

KMA210 is suitable for all automotive applications where a precise mechanical angle needs to be measured -- from electronic steering and active suspension to automatic headlight adjustment. Due to its high accuracy and robustness the part is especially recommended for under-the-hood power train applications, throttle control and air control valve measurements. In addition, the sensor's robustness in high temperature ranges (up to 160°C) makes it ideal for Exhaust Gas Recirculation (EGR) applications -- the heart and mind of emissions control.

NXP's magnetoresistive position sensors enable a safer, cleaner and more comfortable ride. To support global mandates to regulate CO2 in cars, KMA210 sensors can aid in the regulation of the engines untreated emissions. For example, in diesel engines, particle filter regeneration is assisted by throttling intake air which is needed to reduce the amount of emitted particulate mass. NXP's magnetoresistive position sensors enable ETC actuators to act as the load control and idle speed control unit in drive-by-wire engines, thus allowing a precise control of intake air and facilitating the additional implementation of cruise control or Electronic Stability Program (ESP) function.

By designing the Signal Conditioning ASIC in ABCD9, NXP's proprietary automotive grade Silicon on Insulator (SOI) technology based on 140 nm CMOS, the Electromagnetic Compatibility (EMC) performance is significantly improved compared to previous sensor products with integrated ASICs. The device contains two embedded capacitors within the same package which enables system cost reduction as no printed circuit boards or external filter components are required for operation. With respect to robustness, the KMA210 sensor is qualified according to the new HMM (Human Metal Model) and therefore extremely robust with excellent electrostatic discharge (ESD) behaviour. The sensors are fully temperature compensated and ready for use.

Supporting Quotes
Drue Freeman, vice president global automotive sales and marketing, NXP Semiconductors, said: "At NXP, we continue to strive for innovation in automotive technology platforms through leading-edge product and application expertise to make the motoring experience cleaner, safer and more enjoyable. Through close collaboration with key customers during the early stages of design we received excellent guidance on what performance is required to meet the high expectations of the automotive industry with regard to EMC and ESD. The result is a trendsetting device that is extremely robust using the latest in ABCD9 process technology and our expertise in high performance mixed-signal."

Key Features

  • Contactless angle measurements up 180°
  • High temperature range up to 160°C
  • Automotive qualification according AEC Q100
  • Excellent EMC and ESD performance
  • No external capacitors required
  • Overvoltage protection
  • Reflow capable due to MSL1

Availability
KMA210 is currently available in samples and volume production.

Links

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.