SOURCE: Tensilica

Tensilica

February 19, 2013 08:00 ET

New mimoOn Library for Tensilica's Baseband DSP IP Cores Speeds Up LTE and LTE-Advanced Chip Designs

Library Available From Tensilica Saves Customers Millions in Development Costs

SANTA CLARA, CA--(Marketwire - Feb 19, 2013) - Tensilica®, Inc. and mimoOn today announced a new LTE and LTE-Advanced PHY library that will significantly speed up development of chips including Tensilica's ConnX BBE32 family of DSP (digital signal processor) IP cores. mimoOn estimates that the library and their reference designs potentially save SOC (system-on-chip) designers as much as $5 million in development costs.

"Tensilica and mimoOn have the only comprehensive LTE and LTE-Advanced hardware/software PHY IP solution," stated Eric Dewannain, Tensilica's vice president and general manager, baseband business unit. "By working closely together, we enable our customers to get to market much faster and with the lowest power/area for a programmable LTE and LTE-Advanced solution."

"Through our partnership, we've been able to create a customized library to take advantage of the powerful optimizations in Tensilica's baseband architecture, which make Tensilica's ConnX family of DSPs ideal for the compute-intensive challenges of LTE and LTE-Advanced when coupled with our software," stated Brian Meads, mimoOn's vice president of marketing. "Our investment in LTE reference designs represents over 75 man-years of effort and is ongoing as the standards evolve."

The optimized LTE library works with mimoOn's mi!SmallCellPHY and mi!MobilePHY reference chains, which are complete solutions for 3GPP standards, ensuring 100 percent alignment with the standards and future-proofing investments. The library includes optimized basic functions such as FFT/IFFT and LTE specific functions such as rate matching, modulators, interleaving, channel estimation, UE sync and MIMO equalization. The library is complete in that it supports all of the core functions of the reference designs.

Tensilica and mimoOn will jointly demonstrate a low-power, high-performance LTE User Equipment and eNodeB PHY with real-time downlink and uplink traffic at the upcoming Mobile World Congress 2013, February 25-28, in Tensilica's booth in Hall 6, stand D101 and in mimoOn's meeting room in Hall 2, stand 2D60. The efficient software programmable radio demonstration showcases Tensilica's Atlas hardware LTE Reference Platform, which incorporates all of the required functionality with no need for additional external hardware blocks.

About mimoOn
mimoOn GmbH, headquartered in Duisburg, Germany, is a leading licensor of LTE Software IP for mobile devices & wireless infrastructure. mimoOn's portfolio of products includes Physical Layer (PHY) and Protocol Stack (L2/L3) for mobile terminals, small cells (Pico/Femto) and IP development in the areas of advanced PHY algorithms on multi-core SDR platforms, SON, schedulers and radio resource management. mimoOn provides a complete porting, optimization and verification service, as well as a roadmap to future 3GPP releases. For more information, please visit http://www.mimoon.de.

About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP core licensing with over 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

Tensilica is a registered trademark belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.

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