SOURCE: NXP Semiconductors

NXP Semiconductors

October 04, 2011 05:00 ET

NFC Enables Secure Wireless Access to Smart Meters

NXP and Landis+Gyr Showcase Smart Meter With NFC Technology at Metering Europe 2011

AMSTERDAM, THE NETHERLANDS--(Marketwire - Oct 4, 2011) - NXP Semiconductors N.V. (NASDAQ: NXPI) and leading energy management solutions provider Landis+Gyr will showcase smart meters with integrated NFC technology. NFC is a revolutionary wireless technology that enables devices such as smartphones to connect and interact securely with other NFC-enabled devices, such as smart meters. Using NFC, authorized utilities and end-consumers will be able to conveniently access and read smart meter data in real time using a smartphone.

The NFC-enabled smart meter brings together NXP, the global leader in NFC solutions and contactless readers, with Landis+Gyr. The smart meter demonstrator, which integrates the Landis+Gyr E350 modular electricity meter and the NXP PN512 contactless transceiver IC supporting NFC, will be featured in the NXP booth (D02) and in the Landis+Gyr booth (C30) at the Metering Europe event, held in Amsterdam from October 4th through 6th.

Facts for the showcase at Metering Europe:

  • NXP and Landis+Gyr will be showing NFC use cases for visual display, including using an NFC phone to replace the LCD display in smart metering devices, for cost savings and convenience. The NFC smart meter demonstrator will also show how an NFC handset can be used to visualize current and historical energy consumption based on data stored in the meter via a mobile app.
  • From a security standpoint, the demo will show how the embedded secure element in NFC handsets can be used to manage the privacy of individual households, while providing the appropriate level of access for installation and service technicians.
  • In addition, authorized maintenance technicians can download metering information to handsets or tablets, or upload firmware if required to the meter via NFC.
  • A further use case is secure pairing of devices to enable home area network (HAN) communication.
  • Finally, NXP and Landis+Gyr will discuss how NFC phones can be used for secure and convenient pre-payment of electricity and other utilities, alongside contactless cards.
  • Both Landis+Gyr and NXP are active in supporting US and EU-driven initiatives to establish smart grids.
  • The NFC smart meter demonstrator will also be showcased at CarteS 2011, which will be held in Paris from November 14th to 17th, in the "At home" demo area of the NXP booth (4J 035, Hall 4).

Quotes:

  • "NFC opens up new possibilities for the smart grid. It will enable secure, bi-directional communication between metering points and utilities, as well as between smart meters and end-consumers. We can also envision cost-effective NFC solutions tailored specifically for local market needs -- from enabling secure pre-payment via NFC-enabled phones to equipping consumers with mobile apps for personal energy management. We welcome customer feedback on the use cases we're demonstrating together with NXP as we continue to explore new innovations in smart metering," said Daniel Lauk, Head Platforms & Innovation EMEA at Landis+Gyr.
  • "The NFC ecosystem is growing and extends far beyond mobile payments. The smart meter demonstrator we've developed with Landis+Gyr is another example of the numerous use cases for NFC, as new industries take advantage of its security and convenience, as well as the interaction it enables between the physical and virtual worlds. We are thrilled to be working with Landis+Gyr, the leader in advanced energy metering solutions, to explore how utilities and consumers can benefit from the growing pervasiveness of NFC-enabled mobile devices, while making the most of existing energy metering infrastructure," said Henri Ardevol, Vice President and General Manager, Secure Transactions, NXP Semiconductors.

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About NFC
NFC is a market-proven technology co-invented by NXP in 2002. In 2004, NXP co-founded the NFC Forum to lead the collaboration with all industry stakeholders and help standardize the technology. NFC technology evolved from a combination of contactless identification (RFID) and interconnection technologies. Ranked as the No. 1 contactless IC vendor by ABI Research for three years in a row, NXP is the global leader in NFC solutions, field proven in over 150 NFC trials and landmark commercial deployments worldwide. With over 4.5 billion RFID-based chips sold to date, NXP is also the world leader in the design and manufacturing of ICs used in smart labels, tags and the corresponding reader components. NXP has been in the RFID business since 1988 and has developed the most comprehensive IC portfolio (UCODE, NFC, ICODE and HITAG) covering all relevant RFID frequency bands.

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. For more information visit www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

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