SOURCE: NXP Semiconductors

NXP Semiconductors

NXP Semiconductors

June 01, 2011 10:05 ET

NXP Announces Finalists in Its First-Ever High Performance RF Design Challenge

EINDHOVEN, THE NETHERLANDS--(Marketwire - Jun 1, 2011) - NXP Semiconductors N.V. (NASDAQ: NXPI) today announced three teams of finalists in its first-ever High Performance RF (HPRF) Design Challenge. Selected from among 400 entrants, three regional winning teams from EMEA, Asia Pacific and the Americas have been invited to the IEEE MTT-S International Microwave Symposium for 2011 (IMS2011) next week in Baltimore, Maryland.

Over the last few years, RF Power devices based on LDMOS have become more powerful, rugged and cost-effective, allowing the technology to enter new non-RF markets. NXP created the High Performance RF Design Challenge to encourage rising stars within the RF power community to build, test and display innovative designs in new application areas. The Grand Prize winner and respective second- and third-place winners will be announced at the NXP booth (#420) at IMS2011 on Wednesday, June 8 at 5 pm EDT.

The three teams of regional finalists in the NXP High Performance RF Design Challenge are:

Facts / Highlights:

  • Design entries were rated and evaluated by registered community members, alongside a panel of jurors from NXP and universities, based on creativity, efficiency, usefulness, and realization during the three phases of the High Performance RF Design Challenge.

  • The first phase -- Conceptual Design -- required an initial design, including an abstract, title and block diagram. The 400 design entries submitted during this phase showcased innovative ways of using RF as a power source, such as an electric bike charger, complete with a wireless charging station.

  • During the second phase -- Hardware Design -- each contestant developed and provided proof of concept of a prototype, such as a video or measurement report, as well as an accompanying bill-of-materials, schematics, layout file and other design-related material. Highlights among the 51 remaining designs in the second phase included a garbage burner for Mars colonists.

  • During the third phase, the leading teams from EMEA, Asia Pacific and the Americas were given the opportunity to polish their designs in an NXP HPRF design lab, with transportation and accommodation costs covered by NXP. Several creative entries were finalized during this phase, including advanced Doherty designs, Rotman lenses and microwave imaging devices.

  • The winning teams have been invited to IMS2011 and will demo their designs live at the show. The Grand Prize will include a $3,000 Apple Store® voucher.

Supporting Quote:

  • "Our goal with the High Performance RF Design Challenge has been to inspire talented RF engineers to think creatively on how we can bring RF power concepts to life -- in areas extending beyond traditional RF application areas in telecommunications, aerospace and broadcast infrastructure. We've been delighted with both the quantity and quality of submissions from the worldwide RF power community, and applaud all participants in our first-ever HPRF Design Challenge," said John Croteau, senior vice president and general manager, high performance RF and power lighting solutions, NXP Semiconductors.

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About NXP HPRF
Shipping more than 4 billion RF products annually, NXP is a clear industry leader in High Performance RF. From satellite receivers, cellular base stations and broadcast transmitters to ISM (Industrial, Scientific, and Medical) and aerospace and defense applications, NXP is a leader in High Performance Mixed Signal IC products and the recognized leader in SERDES-based serial interfaces for high speed converters. NXP offers a broad selection of high-speed data converters, with digital interfaces including JESD204A compliant CGV, CMOS LVCMOS and LVDS DDR interfaces. These high speed converters are suitable for wireless infrastructure, industrial, scientific, medical, aerospace and defense applications.

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

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