SOURCE: NXP Semiconductors

NXP Semiconductors

March 29, 2011 04:00 ET

NXP Releases World's Smallest Logic Packages for Handheld Mobility

6- and 8-Pin Plastic Leadless Packages Up to 60 Percent Smaller With Improved Mechanical Performance and Robustness

EINDHOVEN, NETHERLANDS--(Marketwire - March 29, 2011) -  NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the world's smallest logic plastic packages measuring 0.9 x 1.0 x 0.35 mm with 0.3 mm pitch. The ultra-compact packaging design is ideal for leading-edge portable handheld devices such as smartphones, tablets and SD cards where chip and board space comes at a premium. The SOT1115 package decreases package size by 10 percent for the 6-pin version compared to the previous smallest package, SOT891, of which NXP has produced over one billion units. The 8-pin SOT1116 decreases the package size by 60 percent, compared to the previous smallest 8-pin package SOT833, enabling manufacturers to radically minimize their PCB size.

"Smartphones and eReaders are getting smaller and thinner. As manufacturers strive to pack more features and functionality into these confined spaces, logic chips provide design flexibility in tiny packages. Logic is the glue that connects everything together," said Pierre-Yves Lesaicherre, senior vice president and general manager, microcontrollers and logic, NXP Semiconductors. "As the largest leadless plastic package manufacturer in the world, we work very closely with the leading innovative customers in the market. Our latest logic leadless packages dramatically shrink package size making it possible to design slimmer phones, tablets and other portable devices without taking up valuable real estate --- offering real return on investment."

NXP has conducted studies of the mechanical failure modes of very small logic packages and determined that leadless plastic packages perform better in terms of mechanical adherence to the PCB. When compared against packages of the same footprint, NXP's leadless packages outperform leaded and leadless WCSP packages of similar size by requiring up to four times more force to dislodge. This is because NXP's leadless packages have a greater contact area with the PCB, giving them better mechanical performance and robustness.

NXP Packaging: SOT1115 and SOT1116
NXP is a leader in small leadless plastic packages and has shipped over two billion of these small leadless plastic packages. Leveraging NXP's unique expertise and dedicated R&D operation, the SOT1115 and SOT1116 are designed for portable devices, where board space, cost and reliability are a primary concern. Key features of the SOT1115 and SOT1116 include the smallest footprint, greatest electrical contact area, and shear force resistance from the PCB. All of NXP's single-, dual- and triple-gate functions are available in these new, smaller packages.

Availability
NXP SOT1115 and SOT1116 packages are available from distribution at US $0.16 and $0.21 respectively. Further information on the new products can be found at: http://ics.nxp.com/packaging/micropak/

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 30 countries, NXP posted revenue of $4.4 billion in 2010. For more information visit www.nxp.com.

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