Milpitas, CA--(Marketwired - May 27, 2014) -
Open-Silicon, a custom ASIC solutions provider, will participate in the Chipestimate.com IP Talks! event during the Design Automation Conference (DAC) 2014. The presentation entitled, "High Performance Memory Solutions - ASIC & FPGA IP solutions for Hybrid Memory Cube (HMC)," will provide an overview of HMC and how it can be used to solve memory bandwidth bottlenecks in complex SoCs.
Manohar Ayyagiri, director of IP at Open-Silicon, will present. Ayyagiri has over 17 years of experience in IP and has held applications and marketing roles.
The panel takes place Tuesday, June 3, 2014, at 11 a.m.
Chipestimate.com Booth #1533, DAC 2014, Moscone Center, San Francisco, Calif.
About Chipestimate.com IP Talks! and DAC
The Chipestimate.com IP Talks! presentations provide an opportunity for DAC 2014 conference attendees learn how the latest in semiconductor IP can help accelerate their design success. The event features leading IP suppliers delivering technical presentations on the latest in design and verification IP. To see the full conference program, please visit http://chipestimate.com/dac2014.
The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, and for electronic design automation (EDA) and silicon solutions. A diverse worldwide community representing more than 1,000 organizations attends each year, represented by system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. To learn more, please visit https://dac.com.
Open-Silicon, a leader in ASIC solutions and developer of customer-specific products (CSPs), provides ASICs, system solutions, concept-to-parts development, specialized IP, low-effort derivative design and state-of-the-art manufacturing solutions. With Open-Silicon, customers benefit from global engineering including the ARM® Technology Center of Excellence, advanced SerDes integration, 2.5D interposer-based package engineering, experienced architects, leading-edge physical design methodology, virtual prototyping and embedded software development. Customers can leverage the industry's best technology from both Open-Silicon and the open market. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.
Open-Silicon is a trademark and service mark of Open-Silicon, Inc., registered in the United States and other jurisdictions. All other trademarks are the property of their respective holders.