SOURCE: Open-Silicon

Open-Silicon

June 08, 2015 08:00 ET

Open-Silicon Expands Management Team

New Executives to Strengthen Company's Flexible ASIC Offering

MILPITAS, CA--(Marketwired - June 08, 2015) - As ongoing effort to provide holistic system-level approach to ASIC design and strengthen specification-to-volume production capability, Open-Silicon's President and CEO, Taher Madraswala, announced the addition of two industry veterans to the executive team: Vasan Karighattam and Amal Bommireddy.

Vasan Karighattam has been promoted to Vice President of Engineering responsible for architecture, SoC design and verification, as well as system software and post silicon validation. In this capacity he will focus on strengthening the company's front-end design capability, thus enabling Open-Silicon to further expand its early customer-engagement strategy. Prior to Open-Silicon, Vasan led the development of next generation architectures of MDSL/HDSL transceivers and Service Framers in the Optical Components group at Intel Corporation and later worked for several years on next generation architecture and front-end development of SOCs for tablets and smart phones. Vasan's 25 years of semiconductor engineering experience also includes positions at Level One Communications, LSI Logic, Acuson Corporation, and Protocol Engines. Vasan holds a master's degree from Michigan Technological University at Houghton and a bachelor's degree from Bangalore University.

"Front-End Design capability is one of Open-Silicon's key differentiators, so this enhanced focus to work with the customer at the specification level will allow us to provide our customers with an even wider selection of cost-effective solutions," said Vasan.

Amal Bommireddy joins the company as Vice President of Engineering responsible for silicon physical design implementation and facilitating the delivery of reliable parts with predictable schedule. Amal has more than 27 years of ASIC and SoC design experience. Prior to joining Open-Silicon, Amal served as VP of Engineering at AMCC where he was responsible for the design of all processor SoCs and managed RTL, verification, DFT, place and route, and physical verification teams to design SoCs from concept to GDS. He has also successfully taken over 20 designs to revenue generating products during his employment at AMCC. Amal was previously the Director of Engineering at Qualcomm, VP of Engineering at Ample Communications and Acclaim Communications, and a Fellow at Acuson Corp. He holds a master's degree from SIU Carbondale and a bachelor's degree from Osmania University.

"I am proud to join Open-Silicon," said Amal. "With its track record of completing 300 ASIC designs and shipping over 100 million ASICs, the company is a leader in providing ASIC solutions to customers on time and at reasonable costs."

"With these changes Open-Silicon now has the seasoned management necessary to provide a wider variety of system-optimized ASICs to our customers," said Taher Madraswala, the company's President and CEO.

Please visit www.open-silicon.com/management for more information.

About Open-Silicon
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design -- architecture, logic, physical, system and software -- and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300 designs and shipped hundred million ASICs to date. Privately-held, Open-Silicon employs over 250 people in Silicon Valley and around the world. www.open-silicon.com

Open-Silicon is a trademark and service mark of Open-Silicon, Inc. registered in the United States and other jurisdictions. All other trademarks are the property of their respective holders.

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