SOURCE: Open-Silicon, Inc.

August 24, 2005 09:00 ET

Open-Silicon Joins TSMC's Design Center Alliance

SUNNYVALE, CA -- (MARKET WIRE) -- August 24, 2005 -- Open-Silicon, Inc., a fabless ASIC company that provides a predictable, reliable and cost-effective alternative to traditional chip design and supply-chain models, and Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) (NYSE: TSM) today announced that Open-Silicon has joined the TSMC Design Center Alliance (DCA) program.

"Open-Silicon's mission is to provide a predictable, reliable and cost-effective ASIC solution," said Dr. Naveed Sherwani, President and CEO of Open-Silicon. "We have worked closely with TSMC since Open-Silicon's inception. This strong partnership has allowed us to provide customers with dramatically improved chances of right-first-time silicon. We are very happy to join TSMC's Design Center Alliance."

"The fabless ASIC business is a fast-growing model," said Rick Cassidy, president of TSMC North America. "By adding Open-Silicon to our Design Center Alliance, we continue to reduce risk at each step of the ASIC implementation process and improve time-to-market."

Open-Silicon takes projects from RTL, netlist or GDSll -- then manages the entire process -- from design engineering, IP procurement, fabrication, package assembly and test, silicon validation and production, through end-of-life.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a fabless ASIC company delivering the most cost-effective, predictable and reliable custom ASIC solution to electronics product customers worldwide. Open-Silicon's OpenMODEL™ is the semiconductor industry's first end-to-end custom ASIC solution based on a revolutionary business model that provides a seamless, low-cost, low-risk alternative to traditional models for complex ASIC design and development. For more information, visit Open-Silicon's website at or call 408-523-1200.

About TSMC Ltd.

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven library, IP, design tools and reference flows. The company operates one advanced 300mm wafer fab, five eight-inch fabs and one six-inch wafer fab. TSMC also has substantial capacity commitments at two joint ventures fabs (VIS and SSMC) and its wholly owned subsidiary, WaferTech. In early 2001, TSMC became the first IC manufacturer to announce a 90-nm technology alignment program with its customers. TSMC's corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC see

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