SOURCE: Palomar Technologies

Palomar Technologies

June 05, 2009 15:04 ET

Palomar Technologies at European Microelectronics and Packaging Conference 2009

Palomar's Daniel D. Evans Jr., Presenting 'Chain Wire Bonding of Optoelectronic Packages Using a Gold Ball Bonder'

CARLSBAD, CA--(Marketwire - June 5, 2009) - Palomar Technologies, a world leader in providing solutions for microelectronic and optoelectronic packaging, and experts in precision wire bonding, complex hybrid packaging, and high accuracy die bonding systems, announced today that it will participate at the European Microelectronics and Packaging Conference 2009 in Rimini, Italy, June 15th - June 18th.

Palomar Technologies' Sr. Scientist, Daniel D. Evans, Jr., will be presenting a paper on "Chain Wire Bonding of a RF-SOE Package using a Gold Ball Bonder." The Chain Wire Bonding method, using Ball Bonding Technology, is a significant breakthrough in advanced packaging. It provides an excellent alternative to traditional wedge bonding. RF-SOE transmitters and other Optoelectronic products have traditionally been packaged using a wedge bonder (where wedge bonding creates strings of loop profiles with short and long profiles). Palomar developed Chain Bonding to meet the growing need for lower cost packaging in combination with higher throughput and increased yield.

The hybrid microelectronic packaging system differs from the semiconductor system in its versatility and ability to handle complex odd-form packaging demands. As the communications, medical, optoelectronic and defense industries continue to require packages that do more with less the complex hybrid packaging system becomes more important due its ability to reduce cost of ownership.

Palomar Microelectronics, the development, test, and contract assembly division of Palomar Technologies performs Chain Bonding for its customers needing a turnkey Optoelectronic Packaging solution. Start-ups and cash-strapped companies find this to be an ideal solution. Microelectronics' experts are able to maximize the versatility of the modern Model 8000 Ball Bonder and create a wide array of solutions that a standard wedge bonder may be too limited in scope to perform.

About Palomar Technologies

Palomar Technologies, formerly part of Hughes Aircraft, is the world's foremost provider of high-precision wire bonders, gold wire bonders, die bonders and automated component placement systems. Palomar combines process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers in the telecommunications, medical, defense and aerospace and commercial high technology industries. Find Palomar on the web at www.palomartechnologies.com. Visit Palomar's blog at solutions.palomartechnologies.com.

Contact Information

  • Contact:
    Rich Hueners
    Palomar Technologies
    Marketing Communications
    Email Contact
    760-931-3691