SOURCE: Palomar Technologies

Palomar Technologies

August 31, 2011 18:00 ET

Palomar Technologies Exhibits at SEMICON Taiwan 2011 and Offers a Laser Interferometer Technology for Wire Bonder Ultrasonic Calibration System

CARLSBAD, CA--(Marketwire - Aug 31, 2011) - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit at SEMICON Taiwan 2011 in Taipei from September 7-9 in booth #1006.

The Palomar Technologies Asia-Pacific team has joined forces with Supremetec Materials, Inc. to offer the latest in high-accuracy die bonders and wire bonder systems at this year's tradeshow. Mr. PH Chan, Palomar Technologies' Asia-Pacific Director, will be on-site to discuss the latest advancements in systems and process development from Palomar Technologies.

"In order to ensure a seamless transfer of equipment, the Palomar Technologies Asian field services team works closely with customers to cover proper planning, coordination and scheduling. Our customers experience a 'plug and play' when the die bonders arrive at their Asian facilities," states Chan. "Most of our Asian customers who previously deployed 3500 Die Bonders have now entered the second phase of their expansion in production capacity by purchasing new equipment. We have seen an increase in customers' decision to switch over to the ultra-flexible 3800 Die Bonder to meet new and more challenging packages, such as those requiring 5-7um placement accuracy at 3-sigma."

Palomar Technologies combines more than 30 years of process know-how with a high-precision line of machines to ensure their bonders maintain production at peak performance. The 2100C Laser Interferometer provides a non-contact method to check the performance of a wire bonder's ultrasonic system through laser interferometer technology. Without calibration, a wire bonder will suffer process inconsistencies. The 2100C makes this calibration an efficient and user-friendly action.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit

Contact Information

  • Palomar Technologies (SE Asia) Pte Ltd. Contact
    Mr. PH Chan
    Asia Pacific Director
    Palomar Technologies
    Email Contact
    (+65) 6779-2766

    Media Contact
    Jessica Sylvester
    Marketing Communications
    Palomar Technologies
    Email Contact
    +1 (760) 931-3681