SOURCE: Palomar Technologies

Palomar Technologies

April 25, 2011 09:00 ET

Palomar Technologies Performs Live Demonstrations of 3800 Die Bonder and 8000 Wire Bonder at SMT Hybrid Packaging 2011 and Hosts Free On-Demand HB LED Webcast

CARLSBAD, CA--(Marketwire - Apr 25, 2011) - Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will perform live demonstrations of the 3800 Die Bonder and 8000 Wire Bonder systems at SMT Hybrid Packaging 2011 in Nuremberg, Germany, on May 3-5.

Palomar Technologies will be showcasing the application capabilities of the high-accuracy 8000 Wire Bonder and the ultra-flexible 3800 Die Bonder -- a recent winner of the 2011 New Product Introduction Awards announced on April 12, 2011. Palomar Technologies will be exhibiting in the Optoelectronic Booth, #6-115D (hall #6).

Julie Adams, director of worldwide sales for Assembly Services (a division of Palomar Technologies), will be on-site at the conference to engage in discussions regarding precision microelectronic contract assembly solutions.

"Assembly Services offers a practical and reliable solution for companies in need of contract assembly, process development and application prototyping," states Julie Adams. "We offer unique solutions such as 2-micron component placement accuracy supported by best-in-class die attach and wire bond equipment along with in-house application engineering experts to tackle your most challenging microelectronic packaging needs -- a company that can prepare your organization and products for volume manufacturing, all while abiding by strict customer confidentiality and maintaining IP."

Assembly Services has developed an efficient process flow in HB LED application production. Assembly Services general manager, Don Beck, discusses the latest advancements in a free on-demand webcast "Automated Precision Assembly for High-Volume HB LED." Watch now to learn more.

About Palomar Technologies
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of die attach solutions, wire bonding equipment, optoelectronic packaging systems and contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to obtain precision wire and ball bonders and automated component placement systems. For more information, visit www.palomartechnologies.com.

Contact Information

  • Contact
    Jessica Sylvester
    Marketing Communications, Palomar Technologies
    Email Contact
    760-931-3681