SOURCE: Palomar Technologies

Palomar Technologies

October 26, 2009 19:15 ET

Palomar Technologies Presents Wire Bond Packaging for Complex Devices

Palomar's Daniel D. Evans, Jr. Presenting "Odd Form Factor Package Wire Bond Case Studies"

CARLSBAD, CA--(Marketwire - October 26, 2009) - Palomar Technologies, a world-leading provider of microelectronics and optoelectronic packaging systems, announces it is exhibiting at IMAPS 2009 in San Jose, CA. Palomar's systems include high precision wire bonding, complex hybrid packaging, and high accuracy die attach solutions.

Palomar Sr. Scientist, Daniel D. Evans, Jr. will present a paper on "Odd Form Factor Package Wire Bond Case Studies." This paper will explore the wire bonding requirements of several devices that could be considered odd form factor package formats or complex microelectronic packages (non-lead frame, non-semiconductor), when compared to mainstream semiconductor packaging. There remains a significant number of applications requiring wildly different sets of capabilities for wire bonding. Mr. Evans will be discussing wire bond challenges and solutions through case studies in RF, Automotive, and Optical markets including challenges with large form factor (12"x6"), deep reach (0.535"), leads and pins.

Recently Palomar designed, manufactured and implemented an automated, full scale, customized microelectronic assembly line with a rated accuracy of 1.5 microns. This integrated high accuracy pick and place assembly line was built for a specific application in the consumer high technology market. This line includes Palomar's Model 6500 Die Bonder and Component Placement System, two GPD Global Dispensing systems, Automatic wafer handler / Die Ejector system to feed the Model 6500 with two handlers book-ending the line. This complete solution comes with Automated Data Management Analysis (ADMA) software that was developed by Palomar to control and trace bonding applications, improving efficiency.

Palomar Microelectronics is the development, test, and contract assembly division of Palomar Technologies. Contract assembly is an ideal solution for customers in need of immediate production of parts/packages while their customized wire and die bonding systems are being built. Start-up and cash-strapped companies also benefit by getting scalable production accomplished while keeping capital costs low.

For more information find Palomar Technologies on the web at www.PalomarTechnologies.com, or visit Palomar's blog at Solutions.PalomarTechnologies.com.

About Palomar Technologies

Palomar Technologies, formerly part of Hughes Aircraft, is the world's foremost provider of wire bonders, gold wire bonders, die bonders and automated component placement systems.

Contact Information

  • Contact:
    Rich Hueners
    Palomar Technologies
    Marketing Communications
    Email Contact
    760-931-3691