SOURCE: PLX Technology

PLX Technology

August 19, 2013 08:00 ET

PLX Technology Chief Scientist to Present at Prestigious HOT CHIPS Symposium

SUNNYVALE, CA--(Marketwired - Aug 19, 2013) - PLX Technology, Inc. (NASDAQ: PLXT), the global leader in PCI Express® (PCIe®) silicon and software connectivity solutions enabling emerging data center architectures, today announced Jack Regula, PLX® chief scientist, has been selected to present at next week's HOT CHIPS Symposium. Regula's presentation, titled Integrating Rack Level Connectivity into a PCI Express Switch, will provide chip-level insight into how a PCIe-based fabric inside the data center rack can eliminate a large number of "bridging" devices that translate PCIe to InfiniBand, Ethernet or Fibre Channel, thus providing higher performance at lower cost and significant power savings.

PCIe is a natural platform to provide converged connectivity inside an enterprise or cloud data center. Virtually all devices -- including host, communication, memory, special-purpose ASIC, and FPGA chips -- have a direct connection to the mainstream PCIe interconnect technology, and many have multiple connections.

The challenge to achieving PCIe-enabled rack-level connectivity is two-fold. First is extending the PCIe architecture to allow true fabric capability, while still remaining 100 percent consistent with the specification. The second is designing and deploying a switch that can integrate the necessary functions within a reasonable power and cost envelope, and in a reasonable time-frame.

Regula's presentation describes such a switch. It explains the architectural enhancements developed to allow PCIe usage at the rack or mini-cluster level in the data center.

PLX's presentation will be held August 26, 5:20 p.m. The HOT CHIPS event will be held Sunday through Tuesday, August 25-27, 2013, at the Memorial Auditorium, Stanford University, Palo Alto, Calif. Review the program and register at

PLX Leadership in PCI Express
PLX is the worldwide market leader in PCIe switch products, with 18 ExpressLane™ PCIe Gen3 switches already in production or sampling -- with many more in development and planning underway for PCIe Gen4 products. In addition to its PCIe switches performing "within the box" to optimize solid-state storage in and of itself, PLX's ExpressFabric® PCIe-based fabric products provide system architects with a powerful "box-to-box" alternative in small- to medium-sized data center clusters. Targeting 20 to1000 nodes in one to eight racks, an ExpressFabric-based rack allows for the elimination of costly and power-hungry protocol translation devices and converges management to a PCIe-based top-of-rack (ToR) switch.

 Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry's leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August on the Stanford University campus in the center of the world's capital of electronics activity, Silicon Valley. The HOT CHIPS conference typically attracts more than 500 attendees from all over the world. It provides an opportunity for chip designers, computer architects, system engineers, press and analysts, as well as attendees from national laboratories and academia to mix, mingle and see presentations on the latest technologies and products. 

About PLX:
PLX Technology, Inc. (NASDAQ: PLXT), based in Sunnyvale, Calif., USA, is the industry-leading global provider of semiconductor-based PCI Express connectivity solutions primarily targeting enterprise data center markets. The company develops innovative software-enriched silicon that enables product differentiation, reliable interoperability and superior performance. Visit PLX on, LinkedIn, Facebook, Twitter and YouTube.

PLX, the PLX logo, ExpressFabric, and ExpressLane are trademarks of PLX Technology, Inc., which may be registered in some jurisdictions. All other product names that appear in this material are for identification purposes only and are acknowledged to be trademarks or registered trademarks of their respective organizations.