SOURCE: ProPlus Design Solutions

March 08, 2016 11:00 ET

ProPlus Design Solutions to Demonstrate Giga-Scale SPICE Simulation Solutions at TSMC 2016 Technology Symposia in North America

Will Also Highlight New MEPro Tool for Process, Device Evaluation

SAN JOSE, CA--(Marketwired - Mar 8, 2016) - ProPlus Design Solutions, Inc., the leading SPICE modeling, giga-scale SPICE simulation and design for yield (DFY) solution provider, will demonstrate its giga-scale SPICE simulators and new process and device evaluation tool during TSMC 2016 Technology Symposia this month.

The TSMC North America events will be held March 15 in San Jose, Calif., March 22 in Boston, and March 24 in Austin, Texas.

Among the products to be demonstrated will be NanoSpice Giga™, and MEPro™. NanoSpice Giga, the first and only GigaSpice simulator, replaces FastSPICE for accurate verification and signoff of large-block and full-chip memory designs. MEPro™, a newly launched tool that bridges circuit design, CAD and process development teams, improves a user's understanding of devices and the process platform through a systematic evaluation of device or circuit level performance targets. It gives users a high degree of confidence on process platform selection and adoption, allows easy management of multiple platforms and process revisions, and provides assistance to improve circuit designs.

ProPlus will host a webinar Thursday, March 31, at 11 a.m. P.D.T., following the final TSMC Technology Symposium, titled, "ProPlus MEPro: A New Tool for Process and Device Evaluation." The 60-minute webinar will be presented by Dr. Bruce McGaughy, ProPlus' chief technology officer. It is meant for CAD and circuit design teams using multiple process platforms from different foundries, or those having early access of process platforms with numerous process revisions. To register, go to: http://bit.ly/1RlyYgy

For more information about ProPlus Design Solutions, visit www.proplussolutions.com

About ProPlus Design Solutions

ProPlus Design Solutions, Inc., delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the leading provider of nano-scale SPICE modeling, the innovative giga-scale SPICE simulation and design for yield (DFY) applications, it provides the industry's golden SPICE modeling platform, the first and only GigaSpice simulator, and the only integrated DFY design platform. Founded in 2006, ProPlus Design Solutions has R&D centers in San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at www.proplussolutions.com

NanoSpice, NanoSpice Giga, NanoYield, BSIMProPlus, NoiseProPlus, MEPro and Nano Design Environment are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

Contact Information

  • For more information, contact:
    Nanette Collins
    Public Relations for ProPlus Design Solutions
    (617) 437-1822
    Email Contact