SOURCE: ProPlus Design Solutions

April 15, 2014 11:00 ET

ProPlus Design Solutions to Exhibit at Upcoming TSMC 2014 Technology Symposia in North America, China and Taiwan

Will Showcase FinFET-Ready DFY Products for Nano-Scale Modeling, Giga-Scale Simulations

SAN JOSE, CA--(Marketwired - Apr 15, 2014) - ProPlus Design Solutions, Inc. will demonstrate its entire line of FinFET-ready Design for Yield (DFY) products for nano-scale modeling and giga-scale simulations at a series of TSMC 2014 Technology Symposium events in April and May.

The North America TSMC 2014 Technology Symposium events where ProPlus will exhibit will be held April 22 in San Jose, Calif., April 29 in Boston, and May 1 in Austin, Texas. ProPlus joins TSMC at the China Symposium in Shen Zhen May 8 and the Taiwan Symposium May 29. 

As the global leader for SPICE modeling solutions and the leading technology provider for Design-for-Yield (DFY) applications, ProPlus offers advanced device modeling software, a parallel SPICE circuit simulator and hardware-validated statistical variation analysis tools. Attendees of the TSMC Technology Symposia will see demonstrations of:

  • NanoSpice™, a next-generation giga-scale high-performance parallel SPICE simulator able to handle more than 500-million element designs, and the core engine of BSIMProPlus™, the leading modeling platform for nanometer devices used by all major foundries for SPICE model generations
  • NanoYield™, a fast, accurate yield versus power, performance, area (PPA) analysis platform for memory, analog and digital designs with 4-7sigma+ High-Sigma Monte Carlo capabilities licensed from and validated by IBM. NanoYield also includes fast process, voltage and temperature (PVT) and fast Monte Carlo applications.
  • A complement of large post-layout analog and memory cases

For more information about ProPlus Design Solutions, visit www.proplussolutions.com.

About ProPlus Design Solutions
ProPlus Design Solutions, Inc. (www.proplussolutions.com) delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. It is the global leader for SPICE modeling solutions and the leading technology provider for unique Design-for-Yield (DFY) products that integrate the key DFY components -- advanced device modeling software, a parallel SPICE simulation circuit simulator and hardware-validated statistical variation analysis tools. Products include: BSIMProPlus™/Model Explorer™, a modeling technology platform for nanometer devices; NoisePro™/9812B/9812D, the golden solution for low-frequency 1/f noise and Random Telegraph Signal (RTS) noise characterization and process monitoring; NanoSpice™, a high-capacity, high-performance parallel SPICE simulator for giga-scale circuit simulation; and NanoYield™/NanoExplorer™, a variation analysis platform for yield versus power, performance and area trade-off of memory, analog and digital circuit designs. ProPlus Design Solutions has R&D centers in the San Jose, Calif. and Beijing and Jinan, China, with sales offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at www.proplussolutions.com.

BSIMProPlus, Model Explorer, NanoExplorer, NanoSpice, NanoYield and NoisePro are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

Contact Information

  • For more information, contact:
    Nanette Collins
    Public Relations for ProPlus Design Solutions
    (617) 437-1822
    Email Contact