SOURCE: Credence Systems Corporation

June 09, 2008 16:15 ET

Ralink Chooses Diamond 40RF ATE Platform From Credence for New WLAN Chipset Solution

MILPITAS, CA--(Marketwire - June 9, 2008) - Credence Systems Corporation (NASDAQ: CMOS), a provider of test solutions for the worldwide consumer semiconductor industry, announced today that Ralink (TSE: 3534), one of the world's leading manufacturers of WLAN chipsets used for Wi-Fi, mobile and embedded applications, has selected the Diamond™ 40RF platform from Credence to test its 802.11n single-chip solutions for Wi-Fi communications.

Ralink has selected the Diamond 40RF (D40 RF) for production testing of its newest devices, the RT3070, the industry's smallest 802.11n USB single chip as client devices and other 11n single-chip solutions. The RT3070 is highly integrated and cost-effective for small form factor and low power applications. In an 8mm x 8mm QFN package, this chip solution benefits from the capability of the D40 RF to meet requirements for RF and digital testing as well as massive multi-site testing. Ralink will also utilize the versatile D40 RF to test monolithically integrated RF transmitters, receivers, systems on chip (SoC), and 10/100Mbps Ethernet physical layer interfaces. Additionally, Ralink expects to drive numerous Diamond 40RF systems with their outsource assembly and test (OSAT) partners in Taiwan, benefiting from the platform's ability to deliver tremendous throughput with a high degree of parallelism for production efficiency and lowest overall cost of production test.

"We chose the D40 RF because of its qualified capability to test our 802.11n SoC. Its ability to test RF, mixed signal and digital in a single platform is ideal," said Dr. Dennis Lo, Senior Vice President of Ralink Technology. "The current RF and digital SoC solutions on Credence's platform were qualified and proven to meet our production requirements. The D40 RF is highly cost-effective, critical to our bottom-line operations as we seek to deliver the performance, interoperability, ease of use and security demanded by our business and consumer-based customers."

The Diamond 40RF test system combines analog, digital, mixed signal, and RF test instrumentation to support a wide range of consumer IC device test. Incorporating Credence's patented MVNA™ (Modulated Vector Network Analysis) technology, the D40 RF adds wireless test capabilities for mobile phone, WLAN, WiMAX and ZigBee devices. Offering from 10 to up to 40 slots, the D40 RF supports over 3000 pins for very large ASIC testing, or massive multi-site test requirements ( > 16 sites) in a modular system architecture that allows the tester infrastructure to grow as the number of sites expands, maintaining test economics. The D40 RF can expand in 10 slot increments ensuring a match of system capability to various test requirements.

Amir Aghdaei, Senior Vice President of Field Operations and Marketing for Credence, said, "We have a long collaborative partnership with Ralink and are delighted to continue to expand our relationship at this exciting time in their growth as a public company. As they seek to grow their market share in the retail and PC markets, and aggressively deploy into handheld multimedia applications, handsets and other consumer electronics segments, we have the ability to meet their demand with our versatile Diamond platforms. We look forward to our mutual success as we assist them in achieving their targeted goals."

About Credence

Credence Systems Corporation is a global provider of automated test equipment (ATE) solutions to the high growth, consumer semiconductor industry. Credence is committed to deliver the highest standards of value -- an optimal combination of technology, turn-around time, reliability, ease of use, service and support -- to every customer, which enables important cost and performance advantages for integrated device manufacturers (IDMs), wafer foundries, outsource assembly and test (OSAT) suppliers and fabless chip companies worldwide. An ISO 9001-certified company with a presence in 20 countries, Credence is headquartered in Milpitas, California. More information is available at

About Ralink

Ralink Technology Corporation is a leading innovator and developer of wireless LAN chipset solutions. Ralink 802.11x chipsets are recognized for superior throughput, extended range, low-power consumption and consistent reliability demanded by Wi-Fi, mobile and embedded applications. These feature-rich chipsets have a high level of chip integration for client and AP solutions for CB, miniPCI, PCI, PCIe and USB interfaces, enabling customers to build smaller and more sophisticated mobile wireless products cost-effectively. Ralink's patented MIMObility™ technology extends Wi-Fi applications from traditional PC networking to a range of digital multimedia and handheld devices including cell phones, PDAs, cameras, print servers, HDTV and video game players. Ralink Technology is headquartered Hsinchu, Taiwan, with an R&D center in Cupertino, California. For more information, visit Ralink at or send email to

Forward-Looking Statements

This release contains statements that are forward-looking within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, including statements regarding the number of Ralink package components that will be tested in production by the end of this year, statements regarding the utilization of the versatile capability of the D40 RF, statements regarding Ralink's outsource assembly and test partners in Taiwan, statements regarding Ralink's growth in retail and PC markets and statements regarding our expectation that we will be able to meet future demand from Ralink with our Diamond platforms. These forward-looking statements involve important factors that could cause our actual results to differ materially from those in the forward-looking statements. Such important factors involve risks and uncertainties including, but not limited to, unanticipated challenges in assessing business conditions and the overall market, unanticipated difficulties in the completion of the transaction, cyclicality and downturns in the semiconductor industry, the timing of new technology, fluctuation in customer demand, timing and volume of orders and shipments, competition and pricing pressures, and reliability and quality issues. Reference is made to the discussion of risk factors detailed in our filings with the Securities and Exchange Commission, including our reports on Form 10-K and 10-Q. All projections in this release are based on limited information currently available to us, which is subject to change. Although any such projections and the factors influencing them will likely change, we will not necessarily update the information, since we are only to provide guidance at certain points during the year. Actual events or results could differ materially and no reader of this release should assume later in the quarter that the information provided today is still valid. Such information speaks only as of the date of this release.

Credence is a registered trademark and Credence Systems and Diamond are trademarks of Credence Systems Corporation. Other trademarks that may be mentioned in this release are the intellectual property of their respective owners.

Contact Information

  • Media Relations Contact:
    Brenda Ropoulos
    Communications Director
    Credence Systems Corporation
    Phone: 408-635-4309
    FAX: 408-635-4986
    E-mail: Email Contact

    Ralink Contact Information:
    Vivien Huang
    Phone: +886-35600868 ext 1605
    E-mail: Email Contact