SOURCE: NXP Semiconductors

NXP Semiconductors

July 17, 2012 08:00 ET

Revolutionary Mobile Audio Solution Delivers Over 5 Times the Power to Micro Speakers

NXP's TFA9887 to Bring a New Generation of Louder, More Reliable Mobile Devices With Better Sound Quality

EINDHOVEN, THE NETHERLANDS--(Marketwire - Jul 17, 2012) - A revolutionary embedded algorithm in a new audio system from NXP Semiconductors N.V. (NASDAQ: NXPI) boosts the output power of micro speakers by over 5 times, vastly improving the sound quality of mobile devices. By driving over 2.6 watts RMS into micro speakers that have previously been limited to 0.5 W, the NXP TFA9887 IC will give mobile phones, portable music players and tablets much louder sound, deeper bass, and higher sound quality -- without risking speaker damage. With a unique combination of safety features including adaptive excursion control and real-time temperature protection, the TFA9887 monitors speakers through a current-sensing amplifier and enables safe operation while working at near peak output at all times.

"Digital natives have come of age taking poor mobile sound quality for granted. As speakers have become smaller, the quiet, tinny sound we've come to associate with mobile devices has got even worse," said Shawn Scarlett, director of marketing, mobile audio product line, NXP Semiconductors. "Our new audio system transforms the listening experience, enabling louder, richer sound quality from virtually any mobile device. The improvement is so striking that consumers, handset makers and operators will immediately hear the difference."

No need to cut bass frequencies
Speaker makers have to balance competing demands for good sound, small size and reliability. As micro speakers have shrunk, phone, media player and tablet designers have been forced to limit output power and sound quality. Amplifiers could easily deliver enough power to destroy the speaker at one frequency, while under-powering it at others. Until now, it has been impossible for system designers to know for sure when it was safe to apply extra power. The rule has therefore been to cut out bass frequencies and limit output power to avoid blowing the speaker -- a common cause of failures in mobiles.

By incorporating circuits that monitor speaker performance and prevent damage, the NXP TFA9887 IC allows designers to break this rule. Adaptive excursion control measures the actual excursion of the speaker membrane to ensure that it never exceeds its rated limit. Real-time temperature protection measures the voice-coil temperature directly to prevent thermal damage.

Boosting audio performance
Because the speaker is fully protected, the system can deliver significant levels of extra power to make the sound louder and better than before. The TFA9887 optimizes the audio signal based on the movement of the speaker, something no other system is capable of, using the full capabilities of the speaker without pushing beyond the limits. An advanced clip avoidance algorithm monitors audio performance and prevents clipping, even when the power supply begins to sag. Bandwidth extension increases the low frequency response well below speaker resonance. And an intelligent DC-to-DC boost converter maximizes audio headroom from any supply level despite battery undervoltage. The TFA9887 automatically adapts to any changes in the speaker -- including ageing, damage to the enclosure, and blocked speaker ports -- helping to optimize performance and maintain the desired sound quality.

The entire system is integrated into a single chip with digital interfaces for portable devices. The IC incorporates NXP's CoolFlux audio DSP, a high-efficiency class-D amplifier with current sensing, and a DC-to-DC boost converter. The advanced, embedded algorithms require no separate licensing. Additional tools allow designers to customize audio sound quality and choose how to optimize mobile device performance.

Availability
Product samples and demo boards of the TFA9887 are available immediately to qualified customers.

Links

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.