SOURCE: RFaxis

RFaxis

June 24, 2009 11:00 ET

RFaxis' Patent Pending Technology Poised to Displace Traditional RF Front-End Modules

Newly Released Whitepapers Detail Industry's First RF Front-End Integrated Circuits; Highlight Noise Figure and Sensitivity Improvements

IRVINE, CA--(Marketwire - June 24, 2009) - RFaxis, an Irvine, California-based fabless semiconductor company focused on innovative, next-generation RF solutions for the wireless and connectivity markets, today announced the availability of two new whitepapers titled, "RF Front-end Integrated Circuits" and "RFaxis System Noise Figure Enhancements: Significant Noise Figure and Sensitivity Improvements in 802.11, Bluetooth and Zigbee Systems." The papers examine the differences between RFaxis' patent pending RF Front-end Integrated Circuits (RFeICs) and conventional FEMs, and detail the advantages gained by using RFeICs, including significant system noise figure improvement, substantial power efficiency, increased bandwidth, and greater range.

Leveraging BiCMOS technologies, along with its own innovative and disruptive approach and technology designs, RFaxis has developed the world's first RFeIC. RFaxis' RFeICs integrate the PA, LNA, transmit and receive switching circuitry, the associated matching network, and the harmonic filter all in a single-chip, single-die device. These RFeICs combine superior performance, high sensitivity and efficiency, low noise, small form factor, and low cost to form an ideal solution for applications requiring low power, extended range and bandwidth, and small form factor.

The RFaxis designs include a high efficiency and high linearity PA for the transmit channel, a high power LNA for the receive channel, a transmit/receive switch, matching and harmonic filters, a transmit power detector, and control circuitry. These parts are available in a 3mm x 3mm QFN package today and will be offered in even smaller packages in Q4 2009.

"We truly feel that our approach has solved the existing RF front-end problems," noted Mike Neshat, president and CEO of RFaxis. "By integrating all of the components required for an RF front-end onto a single-die, we have introduced the lowest cost, highest performance, smallest form factor RF front-end solution in the world, and created a true plug and play device which will change the way engineers and system designers approach their designs. We are simplifying a complex task, thus freeing the designer to tackle other challenges."

The whitepapers also point out that the market is ready for this new advancement in technology, and alternatives to conventional, often burdensome RF front-end modules have not been readily available until now. The current economic climate dictates that all monetary expenditures be efficient, and the use of BiCMOS enables the design of RFaxis' chips to reduce the complexity of wireless designs, lower manufacturing costs via a smaller footprint and reduced bill of materials cost and accelerate time to market. The chips also provide superior performance for a competitive advantage, and are ultra low power to offer improved power efficiency over conventional front-end module technologies.

To obtain copies of the whitepapers, please visit: http://www.rfaxis.com/downloads/index.php

About RFaxis, Inc.

Incorporated in January 2008, RFaxis, Inc. is an Irvine, California-based company specializing in the design and development of RF semiconductors. With its patent pending technologies, the company leads the way in next-generation wireless solutions designed for the multibillion dollar Bluetooth, WLAN, 802.11n/MIMO, Zigbee, WiMAX, WHDI, and mobile phone (CDMA/WCDMA/EDGE/Evolved EDGE/LTE-3G/GSM) markets. Leveraging BiCMOS technology in conjunction with its own innovative approach and technology, RFaxis is home to the world's first RF Front-end Integrated Circuit (RFeIC). More information can be found at: www.rfaxis.com.

Contact Information

  • Media Contact:
    Bob Menzies
    Lages & Associates
    (949) 453-8080
    Email Contact