SOURCE: Rudolph Technologies, Inc.

July 12, 2005 07:00 ET

Rudolph Technologies Unveils New ultra-II CD Metrology Solution at Semicon West 2005

System Combines Focused Beam Ellipsometry and Scatterometry to Offer Thin Film and CD Metrology in a Single Tool

FLANDERS, NJ -- (MARKET WIRE) -- July 12, 2005 -- Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process control equipment for thin film measurement and macrodefect inspection during integrated circuit manufacturing, announces the new ultra-II CD™ system for optical critical dimension (OCD) and thin film metrology in a single tool. The ultra-II eliminates the need for separate CD and film thickness tools, and therefore can offer low cost of ownership, reduce transport delays, and provide rapid notification of yield excursions for deposition, lithography, and etch processes without compromising industry-leading performance.

The ultra-II CD introduces Rudolph's new Simultaneous Multi-angle LASER (SiMuLASE™) Scatterometry, a CD measurement technique based on its high-performance patented Focused Beam Ellipsometry (FBE) technology. The combination of FBE and SiMuLASE Scatterometry™ provides high-speed, non-destructive CD metrology, as well as thickness and optical property measurements for transparent films -- all with superior accuracy, repeatability, and tool-to-tool matching.

"Rudolph's ultra-II CD offers an attractive alternative to other CD metrology techniques due to its high throughput, non-destructive nature, and ability to measure ultrathin films with the accuracy and repeatability required for process control at the 65 nm technology node and below," said Greg Wolf, Rudolph's Director of Transparent Products. "The ultra-II CD can be used on product wafers to measure film thickness on planar or patterned structures as well as line width, depth, and sidewall angle. In addition, it can detect process defects, such as resist footers and top corner rounding. Combining CD and thin film metrology in a single instrument saves time, money, and fab space."

Focused Beam technology, based on the simultaneous collection of data at multiple wavelengths and multiple angles, provides for unsurpassed performance in both CD and film thickness measurement applications. FBE has traditionally offered industry-leading performance when measuring ultrathin films on test wafers or planar test structures, but this capability has now been extended to patterned structures that manufacturers are increasingly adopting to more closely represent how a process will perform on active die. Its OCD capabilities have been specifically developed in collaboration with semiconductor manufacturers to meet process control requirements at the 65 nm node and beyond for advanced transistor formation processes, including shallow trench isolation, poly-gates, and sidewall spacers. The ultra-II optical system provides film thickness measurements with long-term repeatability of 0.03 Ångstroms. The small spot size of the ultra-II CD permits measurements on shrinking test structures -- as small as 50x50 um -- within the scribe line or active die region to meet current and future process requirements.

The ultra-II CD system is available immediately. It includes offline modeling with advanced recipe optimizer and sensitivity analysis for highly automated recipe creation. The tool-based SmartSearch™ data analysis maintains the ultra-II's industry-leading throughput for CD applications.

Note to editor: A photograph of the ultra-II CD is available.

About Rudolph Technologies, Inc.

Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology and defect inspection systems used by semiconductor device manufacturers. The Company's products provide a full-fab solution through its families of proprietary systems, which are used throughout the device manufacturing process. Rudolph's product development has successfully anticipated and addressed many emerging trends that are driving the semiconductor industry's growth in order to enhance the competitiveness of its products in the marketplace. The Company's success in creating complementary metrology and inspection applications through aggressive research and development is key to Rudolph's strategy for continued technological and market leadership.

Safe Harbor Statement

This press release contains forward-looking statements. Actual results may differ materially from those projected due to a number of risks, including, but not limited to, the impact of the slowdown in the overall economy, the uncertainty of the current global political environment, the potential for terrorist attacks, the potential for business disruptions due to infectious diseases, changes in customer demands for our existing and new products, the timing, cancellation or delay of customer orders and shipments, the timing of revenue recognition of shipments, new product offerings from our competitors, changes in or an inability to execute Rudolph Technologies' business strategy, unanticipated manufacturing or supply problems and changes in tax rules. Rudolph Technologies cannot guarantee future results, levels of activity, performance, or achievements. The matters discussed in this press release also involve risks and uncertainties summarized under the heading "Factors that May Affect Future Results" in Rudolph Technologies' Form 10-K filed for the year ended December 31, 2004. These factors are updated from time to time through the filing of reports and registration statements with the Securities and Exchange Commission. Rudolph Technologies does not assume any obligation to update the forward-looking information contained in this press release.

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