SOURCE: SEMATECH

April 26, 2005 11:00 ET

SEMATECH Names Giang Dao as Chief Operating Officer-Advanced Technology

AUSTIN, TX -- (MARKET WIRE) -- April 26, 2005 -- Noted lithography expert Giang Dao has been promoted to vice president and chief operating officer-Advanced Technology at SEMATECH, the global semiconductor technology development consortium. Dao most recently served as director of SEMATECH's Lithography Division.

In his new position, Dao will be responsible for overseeing the operations and strategy of the consortium's Lithography, Front End Processes, and Interconnect divisions, ensuring that they achieve SEMATECH's aggressive technology goals.

"Giang is a professional in every sense of the word," said Michael R. Polcari, SEMATECH's president and CEO. "He has earned a great deal of respect in the industry, and he knows the internal workings of our company. We're fortunate to have him in this executive position as SEMATECH faces new challenges in helping sustain Moore's Law."

"I am both honored and excited about this opportunity to continue my service in this new capacity to bring value to our members and the industry as a whole," said Dao. "I look forward to working with the SEMATECH team to foster innovation and assure manufacturability in critical advanced technologies."

Dao started in the semiconductor industry in 1978, working as a thin film engineer and later as a section head in the advanced oxide isolated bipolar technology development and pilot line at National Semiconductors in Santa Clara, CA. There he developed and implemented integrated multi-layer interconnect systems using polyimide as an interlayer dielectric material. He later moved on to the diffusion (front end process) and lithography areas at National.

In 1984, Dao joined the newly launched Exel Microelectronics, where he became engineering manager. Two years later, he joined Intel as a thin film researcher working on wafer-level electromigration. He subsequently was assigned to lithography, where he initiated I-line and phase shifting mask technology development. During the early 1990s, Dao developed many innovative ways of realizing mask shifting technologies, for which he received numerous patents before the industry began implementation of this fundamental technology. Dao next worked as engineering manager at the Intel's Mask Operation before becoming the company's 157 nm lithography program manager.

Dao was assigned to SEMATECH in 2001 as co-director of Lithography, later becoming the division's sole director. Over the next four years, he guided the division through new lithographic challenges involving 157 nm, 193 nm immersion and extreme ultraviolet (EUV) technologies.

A frequent invited speaker and panelist at international conferences and workshops, Dao served as chair of BACUS 2001. He holds 27 U.S. patents and has published many papers on advanced lithography. He holds a master's degree from the Tokyo Institute Of Technology in Tokyo, Japan.

SEMATECH is a global semiconductor technology development consortium that has effectively represented the semiconductor manufacturing industry on innovation issues since 1988. SEMATECH conducts state-of-the-art research, and is a highly regarded technology partner whose goal is to promote the interests common to all chipmakers. It has extensive experience collaborating with equipment and materials suppliers, as well as government and academic research centers, to refine the tools and technology necessary to produce future generations of chips. Additional information may be found at www.sematech.org. SEMATECH, the SEMATECH logo, AMRC, Advanced Materials Research Center, ATDF, the ATDF logo, Advanced Technology Development Facility, ISMI and International SEMATECH Manufacturing Initiative are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

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