SOURCE: Semblant


November 02, 2015 11:00 ET

Semblant CEO to Keynote CMMF 2015 Waterproof Technology Session

Focus on Protective Nanocoating Technology; Impact on Mobile Device Return Economics

CHANDLER, AZ--(Marketwired - Nov 2, 2015) -  Semblant, the market leader in protective nanocoatings for electronic devices, today announced that CEO Simon McElrea will deliver a keynote at China Mobile Manufacture Forum (CMMF) 2015 on Nov. 16, 2015 from 3:00 to 3:30 p.m. McElrea will present on the topic of the impact of protective nanocoating technology on mobile device return economics. Specifically, he will examine the economic losses resulting from mechanical and liquid damage, and its mitigation through novel nanotechnology shield coatings, such as those designed and deployed by Semblant.

CMMF is the only high-end technology conference in China that focuses on mobile terminal manufacturing technologies. Covering topics ranging from micro component assembly and quality management to today's 3D implementations, FPC, DFX as well as manufacturing enterprise management and executive systems, CMMF has witnessed, and even led, multiple innovations in China's mobile manufacturing technology. McElrea's keynote will be offered as part of the Waterproof Technology: From Materials and Technology to Testing session.

About Semblant
Semblant is the global leader in innovating and deploying nanomaterials in the electronics industry. The company's unique nanotechnology solutions, backed by a broad range of fundamental patents, have been designed specifically to protect electronic devices from liquid ingress, corrosion and many other forms of damage. With thicknesses in the submicron range, Semblant's proprietary plasma-based conformal coatings and protective surface treatments provide remarkable improvements in product reliability, product lifetime, return/repair/resale economics and customer brand loyalty. The company's proprietary equipment sets are cleanroom compliant, high-volume-manufacturing-proven (greater than 1 million units per day capacity installed), and the resulting materials are entirely reworkable (solder-through) and ultra-green (including PFOA- and PFOS-free). To date, the company has provided solutions to the mobile phone, wearable, enterprise computing, network infrastructure, medical device, automotive and space-military-aerospace markets, as well as the printed circuit board and semiconductor/semiconductor packaging industries. For more information, visit us at

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