SOURCE: Antares Advanced Test Technologies

July 10, 2007 18:45 ET

Semiconductor Test Engineers, Buyers to Discuss Thermal Management at Antares Advanced Test Technologies' SEMICON West Booth

Antares to Demonstrate Its Thermal Control Unit (TCU); Feature Burn-in Sockets, Test Sockets and Contactors at Booth 7315, West Hall - Level 1

SANTA CLARA, CA and VANCOUVER, WA--(Marketwire - July 10, 2007) - Antares Advanced Test Technologies -- a global supplier of integrated semiconductor-test equipment focused on maximizing chipmakers' production yields -- announced today that its team at SEMICON(R) West will discuss thermal-management challenges with attendees and demonstrate a TCU at booth 7315 from July 17 - July 19 at San Francisco's Moscone Center.

The Antares team at SEMICON West will talk with attendees about the thermal properties that affect semiconductor packaging, processing and system design, as well as back-end test and burn-in.

"You can't talk about semiconductor test today without talking about thermal management," said Matt Bergeron, Antares' CEO. "The more consumers demand smaller, more powerful devices, the more critical thermal management becomes."

TCUs and thermal management equipment help chipmakers prevent the thermal dissipation and power variances among devices that lower production yields and device throughput, according to Chris Lopez, Antares' manager of thermal management solutions.

Antares' TCU controls a device's temperature during performance testing sequences for device characterization, validation, production or system level testing applications.

Lopez added that the TCU manages temperatures from -55 degrees Celsius to 150 degrees Celsius -- depending on a device's parameters and the TCU's configuration. The unit is portable and can be integrated into ATE handlers or SLT handler systems.

Antares will also feature the following products from its integrated test portfolio at SEMICON West:

Burn-in Sockets:

--  774 Series - large array 0.5mm pitch, compression mount CSP socket
--  773 Series - 0.4mm pitch compression mount, CSP socket
--  880 Series - Clamshell, compression mount 0.4mm pitch QFN
--  881 Series - Clamshell, compression mount, multi-row QFN socket
Test Sockets:
--  Quatrix - revolutionary and proprietary high performance test sockets
    and contactors, Kelvin QFN capability down to 0.5mm pitch
--  Kalypso - high performance test sockets and contactors
For more information on Antares' product portfolio, visit

About Antares Advanced Test Technologies

Antares Advanced Test Technologies is reducing the cost of semiconductor test by concentrating on high-sensitivity areas such as yield and the integration of test disciplines, focusing on customer support, delivering innovative technologies and offering a single point of contact for semiconductor test cell requirements, including burn-in, test sockets, ATE consumables and thermal management solutions. Antares is headquartered in Vancouver, Wash. and has design, development and manufacturing locations in Suzhou, China; Yokohama, Japan; Phoenix and Gilbert, Ariz.; Milpitas and Santa Clara, Calif.; and Aman, Jordan.

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