Semitool Books Multiple Raider(R) Tools to Major Korean Memory Manufacturer and Korean Packaging Foundry

KALISPELL, MT--(Marketwire - June 26, 2008) - Semitool, Inc. (NASDAQ: SMTL), a leading manufacturer of advanced single-wafer electroplating and wafer cleaning equipment for the semiconductor and wafer-level packaging (WLP) industry, today announced it has received orders for six advanced WLP Raider tools that will be used for electroplating, metal etch and photo-resist stripping. The tools are scheduled for delivery in September to a major integrated device manufacturing facility and a packaging foundry, both in Korea. The tools will be used for advanced bumping, Cu Pillar, UBM Etch and resist strip applications, as well as plating of specialty chip interconnect metals used in 3D-TSV (thru-silicon-via) applications.

"Wafer-level packaging, specifically associated with advanced copper devices and memory applications, is one of the fastest growing segments in semiconductor industry today," said Dan Schmauch, director of Semitool's Advanced Packaging Division. "These bookings represent follow-on orders and add to our base of more than 85 Asia Pacific Raider tools installed over the last four years. WLP Raider tools alone account for more than 50 tools in the Asia Pacific region."

Wafer-level packaging is a technology that builds high-reliability chip interconnects on the entire wafer before singulation, and is used as an alternative to wire bonding. High-volume wafer processing equipment allows for greater precision and facilitates smaller and more cost effective, higher density chip interconnects. Today's WLP technology is incorporated in less than 25 percent of all chip manufacturing, but is a growing industry segment.

Safe Harbor Statement

The matters discussed in this news release include forward-looking statements, including statements related to the anticipated delivery of six Raider tools in September, 2008 to customers in Korea. These forward-looking statements are based on management's assumptions as of the date hereof and are subject to risks and uncertainties, including delays in deliveries and cancellations, that are discussed in our filings with the U.S. Securities and Exchange Commission, including our Annual Report on Form 10-K for the fiscal year ended September 30, 2007. We assume no obligation to update forward-looking statements that become untrue because of subsequent events.

About Semitool, Inc.

Semitool designs, manufactures and supports highly engineered, multi-chamber, single-wafer and batch wet chemical processing equipment used in the fabrication of semiconductor devices. The company's primary suites of equipment include electrochemical deposition systems for electroplating copper, gold, solder and other metals; surface preparation systems for cleaning, stripping and etching silicon wafers; and wafer transport container cleaning systems. The company's equipment is used in semiconductor fabrication front-end and back-end processes, including wafer-level packaging.

Headquartered in Kalispell, Montana, Semitool maintains sales and support centers in the United States, Europe and Asia. The company's stock trades on the Nasdaq National Market under the symbol SMTL. For more information, please visit the company's website at www.semitool.com.

Semitool and RAIDER is a registered trademark of Semitool, Inc.

Contact Information: Contacts: Semitool, Inc. Paul Siblerud Vice President 406.752.2107 Pfeiffer High Investor Relations, Inc. Geoff High 303.393.7044 www.pfeifferhigh.com