SOURCE: Sidense

Sidense

June 21, 2017 09:00 ET

Sidense Exhibiting 1T-NVM Memory for Smart Connected Applications at Sensors Expo and Conference

OTTAWA, ON and SAN JOSE, CA--(Marketwired - June 21, 2017) -

What
Sidense will be exhibiting its one-time programmable (OTP) non-volatile memory (NVM) IP at the Sensors Expo and Conference Wednesday, June 28 through Thursday, June 29 in San Jose, Calif. The need to convert analog "real world" events into the digital world (for analysis and response) is seeing unprecedented growth. This almost insatiable demand for sensors is seen across all key market segments. Major drivers include mobile communications, wearables, the Internet of Things (IoT), automotive, industrial and medical electronics.

Stop by the Sidense booth (#1047) to find out how low-cost, secure and reliable 1T-NVM IP, available from 180nm to 16nm including HV and BCD process nodes, can be a key component in your Smart Connected designs for analog/sensor trimming and calibration, code and key storage, device configuration and device ID.

Where and When
Wednesday June 28 and Thursday June 29
McEnery Convention Center
150 W San Carlos St.
San Jose, CA 95113
Booth #1047

About Sidense Corp.
Sidense Corp. provides very dense, highly reliable, and secure Logic Non-Volatile Memory (LNVM) IP for one-time programmable (OTP) and emulated Multi-time Programmable (eMTP) use in standard-logic CMOS processes. The Company, with approximately 170 patents issued, published or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse™ bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-NVM macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming, and device configuration uses.

Over 170 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-NVM as their embedded non-volatile memory solution for more than 670 designs at 60 process nodes. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit www.sidense.com.

About Sensors Expo
For 30+ years, Sensors Expo & Conference has established itself as North America's premier event focused exclusively on sensors and sensor-integrated systems. Join us in the heart of Silicon Valley -- June 27-29, 2017 at the McEnery Convention Center in San Jose, California -- to be a part of the only event where you can find solutions for your present sensing technologies while exploring sensing technologies that are driving tomorrow's solutions. It's more than the industry's leading tradeshow and there's more opportunity than ever to connect with the industry and the technologies driving it.

Contact Information

  • For more information or to schedule a meeting with Sidense please contact
    Andrew Faulkner
    afaulkner@sidense.com
    613-852-4840