SOURCE: Sidense

Sidense

September 05, 2017 09:00 ET

Sidense Exhibiting and Presenting a Paper at the TSMC Open Innovation Platform® (OIP) Ecosystem Forum

OTTAWA, ON and SANTA CLARA, CA--(Marketwired - September 05, 2017) -

What
Sidense is exhibiting and presenting a paper at the TSMC OIP Ecosystem Forum

Where
Santa Clara Convention Center
5001 Great America Pkwy
Santa Clara, CA 95054
Booth #604

When
Wednesday, September 13
8:00AM to 6:30PM

What
Sidense will be exhibiting and presenting a paper, "Robust NVM Solutions for TSMC Specialty and Advanced FinFET Technologies." Sidense will also have a second paper, "Secure Supply Chain Enablement using JTAG IEEE 1149.1™-ECID and Non-Volatile Memory," in the Forum proceedings.

In Booth #604, Sidense will discuss how its 1T-OTP non-volatile memory (NVM) IP is well-suited for many Smart Connected Universe applications, focusing on the fast-growing automotive and mobile communication markets. Meet with our knowledgeable and friendly people to learn how your Mobile Computing, Automotive, IoT, Wearables, Medical and Industrial designs can benefit from Sidense 1T-NVM.

Also at the Sidense booth Intellitech will be demonstrating its NEBULA software communicating with the Silicon Instrument for Sidense 1T-NVM. The demonstration shows how to create a trusted secure platform on a per die basis using IEEE 1149.1-2013 Electronic Chip IDs and security keys.

About Sidense
Sidense Corp. provides very dense, highly reliable, and secure Logic Non-Volatile Memory (LNVM) IP for one-time programmable (OTP) and emulated Multi-time Programmable (eMTP) use in standard-logic CMOS processes. The Company, with over 120 patents granted or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse™ bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-NVM macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming, and device configuration uses.

Over 150 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-NVM as their embedded non-volatile memory solution for more than 500 designs. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit www.sidense.com.

About the TSMC OIP Ecosystem Forum
The TSMC OIP Ecosystem Forum brings together TSMC's design ecosystem companies and our customers to share practical, tested solutions to today's design challenges. Success stories that illustrate TSMC's design ecosystem best practices highlight the event.

At this year's Forum you will hear directly from TSMC OIP companies about how to apply their technologies to address your design challenges. This year, the Forum is a day-long conference kicking-off with trend-setting addresses and announcements from TSMC and leading IC design company executives. The Ecosystem Pavilion features up to 60 member companies showcasing their products and services.

Contact Information

  • For more information or to schedule a meeting with Sidense, please contact:

    Jim Lipman
    Sidense Corp.
    Email contact

    925-606-1370