SOURCE: Sidense

Sidense

September 08, 2015 09:00 ET

Sidense Exhibiting and Presenting at TSMC Open Innovation Platform (OIP) Ecosystem Forum

Sidense to Discuss Ultra Low Power OTP Design for the Smart Connected Universe

OTTAWA, ON and SANTA CLARA, CA--(Marketwired - Sep 8, 2015) -

What
Sidense exhibiting and presenting at the TSMC OIP Ecosystem Forum

Where
Santa Clara Convention Center
5001 Great America Pkwy
Santa Clara, CA 95054

When
Thursday, September 17
8:00AM to 6:30PM

In its booth, Sidense will discuss how its non-volatile memory (NVM) IP is well suited for many Smart Connected Universe applications. The Smart Connected Universe describes a collection of market segments that are both Smart (have computational capability) and are Connected, usually in a wireless network. These segments share a common set of requirements in cost, power and performance and cut across several traditional market segments: Mobile Computing, IoT, Wearables, Automotive, Medical and Industrial.

Sidense's presentation, "Ultra Low Power OTP Design for Smart Connected Universe Applications," will be given by R&D Director Betina Hold and is featured in OIP's EDA/IP/Services track.

For more information or to schedule a meeting with Sidense, please contact:

Jim Lipman
Sidense
jim@sidense.com
925-606-1370

About Sidense
Sidense Corp. provides very dense, highly reliable and secure non-volatile one-time programmable (OTP) Logic Non-Volatile Memory (LNVM) IP for use in standard-logic CMOS processes. The Company, with over 120 patents granted or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse™ bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-OTP macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming and device configuration uses.

Over 130 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-OTP as their NVM solution for more than 400 designs. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit www.sidense.com.

About the OIP Forum
The TSMC Open Innovation Platform® (OIP) Ecosystem Forum is a one-of-a-kind event that brings together the semiconductor design chain community and approximately 1,000 director-level and above TSMC customer executives. The OIP Forum will feature a day-long, three-track technical conference along with an Ecosystem Pavilion that will host up to 80 member companies. The technical sessions are dedicated to 30 selected technical papers from TSMC's EDA, IP, Design Center Alliance and Value Chain Aggregator member companies.

For more information, go to: http://www.hwacomms.com/TSMC2015/OIP/Attendee/index.html

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