Sidense to Exhibit at the GSA Emerging Opportunities Expo and Conference

Company Will Discuss Their Leading-Edge One-Time Programmable (OTP) IP Products for Low-Cost, Secure and Reliable Replacement of Mask ROM, Flash and eFuse


OTTAWA and SANTA CLARA, CA--(Marketwire - September 25, 2009) -


What

Sidense Corp., a leading developer of low-cost and highly reliable Logic Non-Volatile Memory (LNVM) IP cores, will be exhibiting at the GSA Expo on October 1 in Santa Clara, California. Company representatives will be on-hand to discuss Sidense SiPROM and SLP embedded OTP macros covering a broad range of foundry process nodes and variants.

Where

GSA Emerging Opportunities Expo and Conference
Santa Clara Convention Center, Booth 301
Santa Clara, CA

When

Thursday, October 1, 2009
8:30AM - 6PM

For more information or to schedule a meeting with Sidense at the GSA Expo please contact:

Jim Lipman
Sidense Corp.
jim@sidense.com
925-606-1370

About Sidense

Sidense Corp., the only logic non-volatile memory provider listed on EE Times 60 Emerging Startups list for 2009, provides secure, dense and reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes, with no additional masks or process steps required. Sidense's patented one-transistor 1T-Fuse™ architecture (U.S. Patent #7,402,855 and others) provides the industry's smallest footprint, most reliable and lowest power Logic Non-Volatile Memory IP solution and offers an alternative solution to Flash, mask ROM and eFuse in many applications.

Sidense OTP memory is available at 180nm, 130nm, 110nm, 90nm, 65nm, and 55nm and is scalable to 40nm and below. The IP is available at all top-tier semiconductor foundries and selected IDMs. Customers are using Sidense OTP for analog trimming, code storage, encryption keys such as HDCP, RFID and Chip ID, medical, automotive, and configurable processors and logic. For more information, please visit www.sidense.com.

About the GSA Emerging Opportunities Expo and Conference

In its sixteenth year, along with the exhibitor floor the GSA Expo will include seven keynote presentations addressing emerging opportunities changing the landscape of the semiconductor supply chain including energy harvesting, medical applications, 3G wireless gaming, home networks and smart grids. For more information on the Expo visit http://www.gsaglobal.org/expo/2009/index.aspx

Contact Information: Contact: Jim Lipman Sidense Corp. 925-606-1370