SOURCE: SVTC Technologies

SVTC Technologies

SVTC Technologies

August 24, 2009 12:05 ET

siXis Partners With SVTC to Commercialize Breakthrough Computing Modules

SAN JOSE, CA and RESEARCH TRIANGLE PARK, NC--(Marketwire - August 24, 2009) - SVTC Technologies, a leading development and commercialization services company, has been chosen by technology startup siXis, Inc. to supply silicon manufacturing services for their compact, high-speed embedded computing modules that bridge the gap between programmable devices and costly, customized semiconductors.

The siXis modules utilize a unique silicon circuit board (SiCB) architecture using flip-chip bare die and through-silicon vias. This next-generation technology enables siXis to provide smaller, lighter, and lower power embedded computing modules for use in various markets including communications, medical imaging, test and measurement, high-performance computing, and defense and aerospace, as well as advanced semiconductor packaging.

SVTC, with an extensive line of CMOS and MEMS tools for both 200mm and 300mm processing, specializes in enabling customers to bring novel silicon technologies and products to market quickly. siXis, faced with a sudden surge in demand for its new products, chose SVTC for process optimization and pilot production after examining dozens of other facilities.

"We needed a fab that could do both process development and provide a bridge to high-volume production," said John Goehrke, founder and CEO. "SVTC distinguished themselves with their responsiveness, technical capabilities and business processes. They clearly understand our needs, and we're looking forward to a very successful relationship."

Joe Bronson, CEO of SVTC Technologies, said, "We're pleased to be working with siXis to help commercialize their remarkable technology. Startup companies such as siXis can depend on SVTC to develop and commercialize their unique products quickly in an open-access, IP-secure environment."

David Blaker, siXis Vice President of Engineering, said the company's embedded computing modules allow manufacturers to avoid building expensive application-specific integrated circuits (ASICs) for improved functionality.

"There's a gap between programmable devices and ASICs, and we offer the opportunity to extend those programmable devices into higher-end systems," Blaker said. "You can build a cutting-edge device with higher integration for one tenth the cost of an ASIC."

Blaker added that siXis' modules are lighter, more compact, and use less energy than traditional computing modules, filling an increasing market demand for reduced size, weight, and power (SWaP). The modules also enable faster memory processing, which lags the speed of logic devices. "Memory bandwidth is a real pain point in the marketplace, and we offer a cost-effective solution," he said.

About SVTC Technologies

SVTC Technologies speeds the development and commercialization of innovative silicon-based technologies and products, cost-effectively an in an IP-secure manner. Through facilities in San Jose, Calif., and Austin, Texas, SVTC serves customers in rapidly growing markets such as novel memory, novel transistors, logic, MEMS, biotechnology, images sensors and photovoltaics. SVTC offers a suite of leading-edge equipment and services, including full-scale 8-inch and 12-inch process capabilities, advanced CMOS equipment, analytical services, development support tools and commercialization services. SVTC is co-owned by Oak Hill Capital Management and Tallwood Venture Capital, along with management. SVTC Technologies is an equal opportunity employer. More information can be found at

About siXis, Inc.

siXis has created the next generation of embedded computing modules that pave the way for smaller, higher performing, scalable, and lighter electronics that use less power. siXis patent-pending approach uses Silicon Circuit Board (SiCB) technology which combines bare-die and packaged components on large-area silicon substrate, providing superior size, weight, and power characteristics in an industry-standard BGA package.

Through custom variations, including different CPUs, FPGAs, memory, and oscillators, siXis embedded computing modules deliver high performance in a smaller, energy efficient package for a diverse group of markets including communications, high-performance computing, networking, medical imaging, test and measurement, aerospace, and defense.

The company, created with technology developed at RTI International, received CED's 2008 Entrepreneurial Excellence Spin-Out of the Year Award, and is a winner of Tech Journal South's 2009 Tech 50 award. For more information, please visit

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