January 31, 2007 08:00 ET

STABLCOR Provides PCB Manufacturers Replacement for Discontinued Thermount

Additional Benefits Include Thermal Conductivity, Rigidity, and Significant Reduction of Moisture Absorption

COSTA MESA, CA -- (MARKET WIRE) -- January 31, 2007 -- STABLCOR Incorporated, a provider of laminate-based thermal management technology for printed circuit boards and substrates, announced today that its STABLCOR® product is an exceptional replacement material for manufacturers and fabricators of printed circuit boards (PCBs) currently using Thermount to control the thermal expansion of the Printed Circuit Board to match closer with ceramic and flip chip packages.

According to STABLCOR Chief Technology Officer, Kris Vasoya, the company's STABLCOR technology provides an excellent replacement of the discontinued Thermount material. "A multi layer board manufactured with Thermount materials can be duplicated using multiple layers of standard FR4 and two to three layers of STABLCOR embedded into the PCB to achieve the Coefficient of Thermal Expansion (CTE) replicating an existing design," said Vasoya. "An additional benefit of using STABLCOR is the ability to tailor the CTE in a range from 2.5ppm to 12ppm. Achieving this significant advantage is dependent on the placement and amount of material used in the FR4/Polyimide stack-up."

To view comparison test results with boards using Thermount and those manufactured with STABLCOR, visit the company's website at

In addition to the improved CTE achievable through the use of STABLCOR technology, the PCB manufacturer and fabricator will experience the following benefits: less than 50 percent Z-axis expansion, when compared to boards using Thermount materials; no moisture absorption issues; the PCB will act as a heat spreader, which substantially increases thermal conductivity; increased rigidity without increasing the weight of the board; and decreased temperatures in lead-free assembly. To listen to the PCB007 audio interview visit the company's website at


STABLCOR® is the only provider of a thermally and electrically conductive carbon composite material which, when incorporated in printed circuit boards and substrates, controls heat, thermal expansion and increases the rigidity and strength of circuit boards without increasing the weight. The patented laminate and the processes to incorporate STABLCOR into circuit boards and substrates provide the electronics industry a cost efficient technology to produce smaller electronic products while eliminating the thermal, mechanical and reliability concerns that currently challenge the semiconductor industry. For more information about STABLCOR visit the company's website at

THERMOUNT® is a registered trademark of the DuPont Company | STABLCOR® is a registered trademark of STABLCOR, INC.

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