SOURCE: Upstream Value Group
PORTLAND, OR--(Marketwire - Jun 7, 2011) - Upstream Value Group, a leading technology capital recovery and valuation team, today announced a 4-Day online equipment auction for HVVi Semiconductors Inc. This online auction features more than $3 Million in original equipment acquisition cost and features semiconductor and RF test equipment, inspection, environmental chambers and ovens, executive and modular office furnishings, facility equipment and more.
"We expect global interest in this offering," said Don Cowan, managing director of Upstream Value Group. "These assets will find new homes in the semiconductor, avionics, ISM, telecom, wireless or microwave industry. Equipment of this caliber and quality is a rarity in today's market," continued Mr. Cowan.
Equipment highlights include: an Amadyne FAB-1 Die Bonder, Hesse and Knipps Bondiet 815 Wedge Wire Bonder, Finetech Bonders, Asymtek Underfill Epoxy Dispensing System, FETtest 3400E DE Tester, a Rohde and Schwarz FSQ26 Signal Analyzer and a Maury Microwave Load Pull System.
The online auction will begin on Monday, June 20th and close on Thursday, June 23rd. Equipment can be previewed by appointment at HVVi Semiconductors Inc. in Phoenix, AZ. More information and a comprehensive auction catalog with photos can be found by visiting: www.ar-int.com.
About Upstream Value Group
Upstream Value Group is a capital recovery firm focused exclusively on helping leaders venture finance maximize value for a distressed company's tangible and intangible assets. The group is a collaboration between Don Cowan LLC, Asset Reliance International and Generation Management, all industry experts that have earned reputations for success and excellence. For more information, contact Don Cowan at email@example.com.