UNITED STATES--(Marketwire - August 24, 2007) - Singapore -- 8/24/2007 -- STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (
NASDAQ:
STTS) (SGX-ST: STATSChP), a
leading independent semiconductor test and advanced packaging service
provider, today announced the resignation of the following directors with
effect from August 24, 2007:
(a) Mr. Lim Ming Seong;
(b) Mr. Steven H. Hamblin;
(c) Mr. Richard J. Agnich;
(d) Dr. Park Chong Sup; and
(e) Dr. Robert W. Conn
"On behalf of the Board, I would like to express our appreciation to Ming
Seong, Steve, Dick, CS Park and Bob for their past contribution to the
Board. They have played a key role in the transformation and success of the
Company. Their active contribution to deliberations at the Board and their
insights, experience and wise counsel will be missed," said Charles
Wofford, Chairman of STATS ChipPAC.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (
NASDAQ:
STTS)
(SGX-ST: STATSChP) is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions. A trusted partner and
supplier to leading semiconductor companies worldwide, STATS ChipPAC
provides fully integrated, multi-site, end-to-end packaging and testing
solutions that bring products to the market faster. Our customers are some
of the largest wafer foundries, integrated device manufacturers (IDMs) and
fabless companies in the United States, Europe and Asia. STATS ChipPAC is a
leader in mixed signal testing and advanced packaging technology for
semiconductors used in diverse end market applications including
communications, power, digital consumer and computing. With advanced
process technology capabilities and a global manufacturing presence
spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC
has a reputation for providing dependable, high quality test and packaging
solutions. The Company's customer support offices are centered in the
United States (California's Silicon Valley, Arizona, Texas, Massachusetts,
Colorado and North Carolina). Our offices outside the United States are
located in South Korea, Singapore, China, Malaysia, Taiwan, Japan, the
Netherlands and United Kingdom. STATS ChipPAC's facilities include those
of its subsidiary, Winstek Semiconductor Corporation, in Hsinchu District,
Taiwan. These facilities offer new product introduction support,
pre-production wafer sort, final test, packaging and other high volume
preparatory services. Together with our research and development centers in
South Korea, Singapore, Malaysia, China, Taiwan and the United States as
well as test facilities in the United States, this forms a global network
providing dedicated test engineering development and product engineering
support for customers from design to volume production. STATS ChipPAC is
listed on both the Nasdaq Stock Market (NASDAQ) and the Singapore Exchange
Securities Trading Limited (SGX-ST). In addition, STATS ChipPAC is also
included in the Morgan Stanley Capital International (MSCI) Index. Further
information is available at
www.statschippac.com. Information contained in
this website does not constitute a part of this release.
Contact Information: Singapore Contact:
Tham Kah Locke
Vice President, Corporate Finance
Tel: (65) 6824 7788
Fax: (65) 6720 7826
email:
US Contacts:
Lisa Lavin
Marcom Manager
Tel: (208) 939 3104
Fax: (208) 939 4817
email:
The Ruth Group
David Pasquale
Executive Vice President
Tel: (646) 536 7006
email: