SINGAPORE--5/19/2010, UNITED STATES--(Marketwire - May 19, 2010) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) today announced the recipients of its annual Supplier Excellence Awards honoring the Company's top materials and equipment suppliers for their excellent service and outstanding support. The Supplier Day celebration, held on May 19, 2010 in Singapore, recognized Samsung Electro-Mechanics Co., Ltd, Tanaka Kikinzoku International K.K., Verigy Ltd, Nitto Denko Corporation and Teradyne, Inc. as top performing suppliers for 2009.
STATS ChipPAC's Supplier Excellence Awards honor materials and equipment suppliers who provide exemplary services and performance to STATS ChipPAC and its customers by demonstrating excellence in quality, on-time delivery, technology, service, flexibility and cost competitiveness.
"STATS ChipPAC congratulates our suppliers who have demonstrated exemplary service and support to our goal of providing global supply chain excellence to our customers," said Wan Choong Hoe, Executive Vice President and Chief Operating Officer of STATS ChipPAC. "At STATS ChipPAC, we are committed to deliver to our customers the highest level of operational excellence and performance. We would like to recognize those suppliers who have consistently demonstrated a strong level of collaboration and shared commitment to enable STATS ChipPAC to deliver high quality, cost-effective packaging and test solutions to our customers."
The winners by category are:
Best Supplier Award
Samsung Electro-Mechanics Co., Ltd
Tanaka Kikinzoku International K.K.
Verigy Ltd
Excellence in Service Award
Nitto Denko Corporation
Teradyne, Inc.
Forward-Looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; possible future application of push-down accounting; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilization; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; shortages in supply of key components; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labor union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases, the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"); and other risks described from time to time in the Company's filings with the U.S. Securities and Exchange Commission, including its annual report on Form 20-F dated March 5, 2010. You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.
Contact Information:
Investor Relations Contact:
Tham Kah Locke
Vice President of Corporate Finance
Tel: (65) 6824 7788
Fax: (65) 6720 7826
email: