August 22, 2011 16:00 ET

STATS ChipPAC Honors Top 2010 Suppliers for Excellent Service and Outstanding Support

SINGAPORE--08/23/2011, UNITED STATES--(Marketwire - Aug 22, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) today announced the recipients of its fourth annual Supplier Excellence Awards honoring the Company's top material and equipment suppliers for their excellent service and outstanding support.

The Company's top honor, "Best Supplier Award", was given to four suppliers for overall best-in-class performance in cost, quality, delivery, technology, service and support. STATS ChipPAC recognised six suppliers with an "Outstanding Award in Service and Support" for excellent service, support and responsiveness. Two companies were recognised for outstanding service and support for STATS ChipPAC's operations in China and Singapore. The winners by category are:

Best Supplier Award
NAMICS Corporation
Samsung Electro-Mechanics Co., Ltd.
Tanaka Kikinzoku International K.K.
Verigy Ltd. (of Advantest Group)

Outstanding Award in Service and Support
BE Semiconductor Industries N.V.
Daewon Semiconductor Packaging Industrial Co., Ltd.
DISCO Corporation
Heraeus Materials Technology LLC
Nitto Denko Corporation
Rudolph Technologies, Inc.

Outstanding Site Award in Service and Support
LG Chem Ltd. (for STATS ChipPAC Shanghai)
Teradyne, Inc. (for STATS ChipPAC Singapore)

"STATS ChipPAC views our suppliers as business partners who enable us to successfully deliver the highest level of quality and operational excellence for our customers in cost-effective packaging and test solutions. We expect our suppliers to share the same intense focus and commitment to performance, quality, cycle-time and cost innovation that we strive for as a company," said Wan Choong Hoe, Executive Vice President and Chief Operating Officer, STATS ChipPAC. "We would like to congratulate all of our top suppliers for their achievements last year and look forward to their continued support."

Forward-Looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, shortages in supply of key components and disruption in supply chain; general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"). You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at Information contained in this website does not constitute a part of this release.

Contact Information

  • Investor Relations Contact:
    Tham Kah Locke
    Vice President of Corporate Finance
    Tel: (65) 6824 7788
    Fax: (65) 6720 7826
    email: Email Contact

    Media Contact:
    Lisa Lavin
    Deputy Director of Corporate Communications
    Tel: (208) 867-9859
    email: Email Contact