SOURCE: STATS ChipPAC

STATS ChipPAC

July 18, 2012 09:00 ET

STATS ChipPAC Honours Top Suppliers for Excellent Performance and Outstanding Support

SINGAPORE--18/07/2012--UNITED STATES--(Marketwire - Jul 18, 2012) -  STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) today announced the recipients of its annual Supplier Awards honouring the Company's top supplier partners for their excellent performance and outstanding support in 2011. The Supplier Awards program is designed to drive leadership in supply management for STATS ChipPAC, its supplier partners and its customers. Supplier partners are scored on multiple criteria including technology, quality, delivery, responsiveness, service and cost competiveness.

STATS ChipPAC's top honour, "Best Supplier Award", was given to five companies for overall best-in-class performance in cost, quality, delivery, technology, service and support. STATS ChipPAC recognised ten companies with an "Outstanding Award in Service and Support" for overall excellent performance, service and support. Six companies which had a significant impact on a particular STATS ChipPAC manufacturing site were recognised with an "Outstanding Site Award in Service and Support". The winners by category are:

Best Supplier Award

  • Advantest Corporation
  • BE Semiconductor Industries N.V.
  • Nagase & Co., Ltd.
  • NAMICS Corporation
  • Samsung Electro-Mechanics Co., Ltd.

Outstanding Award in Service and Support

  • Daewon SPIC/Peak International
  • EO Technics Co., Ltd.
  • FedEx Express
  • Heraeus Materials Technology
  • Kinsus Interconnect Technology Corporation
  • Kulicke & Soffa Pte Ltd
  • MK Electron Company, LTD
  • Mitsui High-tec, Inc.
  • SEMICS Inc.
  • Teradyne, Inc.

Outstanding Site Award in Service and Support

  • Korea Semiconductor System Co., Ltd. (for STATS ChipPAC Korea)
  • Oriental Mercury International Cargo Transportation Co., Ltd. (for STATS ChipPAC Shanghai)
  • Samsung Techwin Co., Ltd. (for STATS ChipPAC Singapore)
  • Skymaster Express Inc. (for STATS ChipPAC Korea)
  • Tanaka Kikinzoku International K.K. (for STATS ChipPAC Singapore)
  • Unimicron Technology Corporation (for STATS ChipPAC Korea)

"The Supplier Awards program recognises those companies whose successful performance has made a difference in helping STATS ChipPAC deliver a responsive, high quality and cost effective manufacturing solution that enables our customers to succeed in the market," said Wan Choong Hoe, Executive Vice President and Chief Operating Officer, STATS ChipPAC. "We are proud to honour the outstanding supplier partners that have exhibited excellence in their performance and a dedication to quality and cost competitiveness throughout the year. I sincerely congratulate the Supplier Award winners for their accomplishments in 2011."

Forward-Looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, the timing and impact of the expected closure of our Thailand facility as well as the estimated associated cost for the closure; the amount of the property damage and business interruption insurance claim due to flooding of our Thailand facility; the ability to shift production to other manufacturing locations, shortages in supply of key components and disruption in supply chain; general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"). You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.

Contact Information

  • Investor Relations Contact:
    Tham Kah Locke
    Vice President of Corporate Finance
    Tel: (65) 6824 7788
    Fax: (65) 6720 7826
    email: Email Contact

    Media Contact:
    Lisa Lavin
    Deputy Director of Corporate Communications
    Tel: (208) 867-9859
    email: Email Contact