SINGAPORE - 12/14/2010, MILPITAS, CA--(Marketwire - December 14, 2010) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, and Intersil Corporation (
Utilizing copper wire interconnect in semiconductor packages offers a number of advantages over gold wire. Copper wire is more electrically and thermally conductive, allowing it to readily replace gold wire without any decrease in electrical or thermal performance. Copper also possesses stronger mechanical properties and is capable of carrying higher currents than the same diameter gold wire, thereby allowing for longer wire lengths and increased manufacturability. These factors are important for enhanced device performance and yield.
"High-performance analog and mixed-signal markets are extremely competitive and require continuous innovation and enhancement of products and services. Using copper wire interconnect capability allows Intersil to provide its customers with performance and manufacturability advantages. Our business is dependent upon reliable fabrication, packaging and testing of our products and we have worked closely with STATS ChipPAC to select and qualify copper wire interconnect for our package offerings. Copper may well be the new gold in semiconductor packaging," said Sagar Pushpala, Senior Vice President of Worldwide Operations and Technology at Intersil.
Intersil and STATS ChipPAC completed a stringent qualification process with four major wafer foundries across multiple technology nodes. STATS ChipPAC established a Class 1000 cleanroom to ensure the integrity, yield and reliability of the copper material and a robust assembly and test process that has demonstrated best-in-class yields and reliability that is on par with gold wire bond interconnect.
"There are clear performance and cost benefits with the use of copper wire interconnect. Customer demand is steadily ramping up, particularly as customers see the technology mature and the proven range of package types and applications enabled with copper wire interconnect expand. STATS ChipPAC has shipped over 100 million units with copper wire interconnect in a wide range of leaded and laminate packages. We continue to expand our copper wire program to include more advanced packaging such as advanced wafer fab nodes with delicate bond pad structures, fine bond pad pitch, stacked die, die-to-die bonding and ultra low loop height applications," said Wan Choong Hoe, Executive Vice President and Chief Operating Officer, STATS ChipPAC.
Forward-Looking Statements
Certain statements in this release, including the continued increase in demand for copper wire interconnect, are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilization; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; shortages in supply of key components; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of STATS ChipPAC as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labor union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases, the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"); and other risks described from time to time in STATS ChipPAC's filings with the U.S. Securities and Exchange Commission, including its annual report on Form 20-F dated March 5, 2010. You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.
About Intersil
Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed signal and power management semiconductors. Intersil's products address some of the fastest growing markets within the communications, computing, consumer and industrial industries. For more information about Intersil or to find out how to become a member of our winning team, visit Intersil's web site and career page at www.intersil.com.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.
Intersil and the Intersil logo are trademarks or registered trademarks of Intersil Corporation. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.
Contact Information:
Investor Relations Contact:
Tham Kah Locke
Vice President of Corporate Finance
Tel: (65) 6824 7788
Fax: (65) 6720 7826
email: