Contact Information: Singapore Contact: Bryan Ong Investor Relations Tel: (65) 6824 7477 Fax: (65) 6720 7826 email: Email Contact US Contacts: Drew Davies Director, Investor Relations Tel: (408) 586 0608 Fax: (408) 586 0652 email: Email Contact Lisa Lavin Marcom Manager Tel: (208) 939 3104 Fax: (208) 939 4817 email: Email Contact The Ruth Group David Pasquale Executive Vice President Tel: (646) 536 7006 email: Email Contact
STATS ChipPAC Ltd. Schedules Fourth Quarter 2006 Results Conference Call
| Source: STATS ChipPAC
UNITED STATES -- (MARKET WIRE) -- January 8, 2007 -- SINGAPORE -- 1/8/2007 -- STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (NASDAQ : STTS ) (SGX-ST: STATSChP), a
leading independent semiconductor test and advanced packaging service
provider, today announced it will hold a conference call with investors and
analysts on Thursday, January 25, 2007 at 8 a.m. in Singapore to discuss
results for the Company's fourth quarter 2006 and business outlook. This
will be 7 p.m. in New York on Wednesday, January 24, 2007.
The news release announcing the fourth quarter 2006 results will be
disseminated on January 24, 2007 after the Nasdaq stock market closes.
The dial-in number for the live audio call beginning at 8 a.m. (Singapore
time) on Thursday, January 25, 2007, or 7 p.m. (New York time) on
Wednesday, January 24, 2007 is +1-201-689-8560. A live webcast of the
conference call will be available on STATS ChipPAC's website at
www.statschippac.com.
A replay of the call will be available 2 hours after the live call through
noon on Thursday, February 1, 2007 (in Singapore) or midnight on Wednesday,
January 31, 2007 (in New York) at www.statschippac.com and by telephone at
+1-201-612-7415. The account number to access the replay is 3055 and the
conference ID number is 225166.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (NASDAQ : STTS )
(SGX-ST: STATSChP), is a leading service provider of semiconductor
packaging design, assembly, test and distribution solutions. A trusted
partner and supplier to leading semiconductor companies worldwide, STATS
ChipPAC provides fully integrated, multi-site, end-to-end packaging and
testing solutions that bring products to the market faster. Our customers
are some of the largest wafer foundries, integrated device manufacturers
(IDMs) and fabless companies in the United States, Europe and Asia. STATS
ChipPAC is a leader in mixed signal testing and advanced packaging
technology for semiconductors used in diverse end market applications
including communications, power, digital consumer and computing. With
advanced process technology capabilities and a global manufacturing
presence spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS
ChipPAC has a reputation for providing dependable, high quality test and
packaging solutions. The Company's customer support offices are centered in
the United States (California's Silicon Valley, Arizona, Texas,
Massachusetts, Colorado and North Carolina). Our offices outside the United
States are located in South Korea, Singapore, China, Malaysia, Taiwan,
Japan, the Netherlands and United Kingdom. STATS ChipPAC's facilities
include those of its subsidiary, Winstek Semiconductor Corporation, in
Hsinchu District, Taiwan. These facilities offer new product introduction
support,
pre-production wafer sort, final test, packaging and other high volume
preparatory services. Together with our research and development centers in
South Korea, Singapore, Malaysia, China, Taiwan and the United States as
well as test facilities in the United States, this forms a global network
providing dedicated test engineering development and product engineering
support for customers from design to volume production. STATS ChipPAC is
listed on both the Nasdaq Stock Market and the Singapore Exchange
Securities Trading Limited. In addition, STATS ChipPAC is also included in
the Morgan Stanley Capital International (MSCI) Index and the Straits Times
Industrial Index. Further information is available at www.statschippac.com.
Information contained in this website does not constitute a part of this
release.
Certain statements in this release, including statements regarding expected
future financial results and industry growth, are forward-looking
statements that involve a number of risks and uncertainties that could
cause actual events or results to differ materially from those described in
this release. Factors that could cause actual results to differ include
general business and economic conditions and the state of the semiconductor
industry; level of competition; demand for end-use applications products
such as communications equipment and personal computers; reliance on a
small group of principal customers; decisions by customers to discontinue
outsourcing of test and packaging services; continued success in
technological innovations; availability of financing; delays in acquiring
or installing new equipment; our substantial level of indebtedness;
potential impairment charges; ability to develop and protect our
intellectual property; intellectual property rights disputes and
litigation; capacity utilization; limitations imposed by our financing
arrangements which may limit our ability to maintain and grow our business;
pricing pressures including declines in average selling prices; changes in
customer order patterns; shortages in supply of key components; disruption
of our operations; loss of key management or other personnel; defects or
malfunctions in our testing equipment or packages; changes in environmental
laws and regulations; exchange rate fluctuations; regulatory approvals for
further investments in our subsidiaries; significant ownership by Temasek
Holdings (Private) Limited (Temasek Holdings) that may result in
conflicting interests with Temasek Holdings and our affiliates; our ability
to successfully integrate the operations of former STATS and ChipPAC and
their employees; labor union problems in South Korea; uncertainties of
conducting business in China; unsuccessful acquisitions and investments in
other companies and businesses; and other risks described from time to time
in the Company's SEC filings, including its annual report on Form 20-F
dated February 28, 2006. We undertake no obligation to publicly update or
revise any forward-looking statements, whether as a result of new
information, future events or otherwise.